Transient liquid phase bonding mechanism and microstrueture ofMGH956 joints

Tile interlayer alloy KCol is developed for transient liquid phase (TLP) diffusion bonding of MGH956 superalloy.The relative as-pects have been analyzed about the mierostrueture of the joint,elementsand bonding technologies.The TLP bonding mechanism of MGH956 superalloy has been verified.At the same time,the residues in the joints ofMGH956 superalloy are analysed further.The experimental results show that the integrated joints without the residues could be attained on the condition of 1 240%/8 h.