Diffusion bonding of TiB2 cermet to TiAl intermetallic
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Graphical Abstract
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Abstract
The diffusion bonding of TiB2 cermet to TiAl intermetallic was studied in this paper.The effects of bonding parameters on the microstructure of the joints and mechanical properties was investigated.The results showed that a Ti (Cu,Al)2 intermetallic layer was formed at the interface between TiB2 cermet and TiAl intermetallic when directly diffusion bonding.A TiAlNi2 intermetallic layer and two Ti,Al,Ni solid solution layers were formed at the interface by using Ni interlayer.The shear strength was 103 MPa when directly diffusion bonding with bonding temperature T=1 223 K,bonding time t=1.8 ks and bonding pressure p=80 MPa,and the shear strength was 110 MPa by using Ni layer with T=1 223 K,t=1.8 ks and p=80 MPa.
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