TLP Diffusion Bonding of Aluminum Base Composite and Aluminum Alloy

The experimental study on TLP diffusion bonding of SiC particle reinforced Al-based composite and aluminium alloy is conducted,and the microstructures of TLP diffusion bond is observed using SEM(S530),and the concentration profiles of elements in the joint area are measured using EDS(Link Systems 860 Analyzer).The research indicated that the bonding interface departures to aluminium alloy from the original central line in the joint area of SiC particle reinforced Al-based composite and aluminium alloy,and the concentration profile of solute atoms distribute fairly asymmetrically.Because of difference of the solute atoms diffusion speeds and the metallurgical reaction between interlayer and base metal,the dissymmetry exists obviously in TLP diffusion bonding process of aluminum base composite and aluminum alloy.The study provides a scientific basis for the bonding of composite and metal.