Numeric Simulation for Diffusion Bonding

In this paper, the recent conclusions and methods of studies on numeric simulation for diffusion bonding in the world are introduced briefly. Interface void shrinkage models, the element diffusion of interface and the growing model of reacting layer, and numeric simulation for stresses and stains of interface are discussed respectively, so that the effect of diffusion bonding parameters on bond performance can been analyzed qualitatively and semi-quantificationally.