Transient Liquid Phase(TLP) Diffusion Bonding of Copper Alloy to Stainless Steel Using CuMu Alloy as Interlayer

The transient liquid phase diffusion bonding of Cu alloys(CuAlBe) to stainless steel(1Cr18Ni9Ti) with CuMn alloy as interlayer was carried out.The kinds of the reaction products and the interface structures of the joints were investigated by SEM,EPMA and XRD.The results show that bonding pressure,bonding time,bonding temperature and the content of Mn in CuMn alloy had great effect on the strength of joints.When they were 1MPa,40min,1223K and 30wt% respectively the joint strength was up to 487MPa,the fracture of which was a plastic one.In this paper,the effect of Mn in CuMu interlayer was analyzed.It was found that the structure of interface and the strength of joints were improved greatly by the element Mu of CuMn alloys.