Chen Zheng, Li Zhizhang, Zhao Qizhang, Lou Honqing. Bonding Al2O3 to Cu with Ti Foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (4): 200-205.
Citation:
Chen Zheng, Li Zhizhang, Zhao Qizhang, Lou Honqing. Bonding Al2O3 to Cu with Ti Foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (4): 200-205.
Chen Zheng, Li Zhizhang, Zhao Qizhang, Lou Honqing. Bonding Al2O3 to Cu with Ti Foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (4): 200-205.
Citation:
Chen Zheng, Li Zhizhang, Zhao Qizhang, Lou Honqing. Bonding Al2O3 to Cu with Ti Foil[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1997, (4): 200-205.
onding Al2O3 to Cu was performed by directly using Ti foil at 1273K.The microstructure of the joint interface was investigated by SEM.EDX and XRD analyses.The mechanism of the effects of Ti foil thickness on the reaction layer thickness and the joint strength was analyzed.
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