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Zhang Bangwei, Tan Zhaosheng, Zhang Heng, Yu Jneqi, Shu Xiaolin. Funjamental research for Cu-P based amorphous filler alloys[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1992, (3): 133-139.
Citation: Zhang Bangwei, Tan Zhaosheng, Zhang Heng, Yu Jneqi, Shu Xiaolin. Funjamental research for Cu-P based amorphous filler alloys[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1992, (3): 133-139.

Funjamental research for Cu-P based amorphous filler alloys

  • The amorphous formation range (AFR) of Cu87.6-xNi8.3S4.1Px alloy wastudied in this paper. It has been found that the alloy was amorphous when x=11.9 to 16.5at%,and its AFR was larger than that of Cu90-xNi10PT alloys. The dependences of melting point; wettability, mechanical and electrical properties, and microstructure on the phosphorus content were determined. The data have shown that the tensile strength increases and the wettability decreases as the phosphorus increases, of which the reasons were discussed. The determined data for the amorphous Cu-Ni-Sn-P alloys indicate that Ag-Cu based filler alloys could be replaced by the amorphous alloys.
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