Citation: | WANG Guanghui, LIU Xu, ZHANG Yu, TIAN Hao, SONG Xiaoguo. Analysis of the response surface method for optimising the flatness of ceramic-metal brazing[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2025, 46(3): 120-126. DOI: 10.12073/j.hjxb.20231204001 |
Ceramic-to-metal packaging is widely used as a key process in electronic vacuum devices in integrated circuit packaging, medical devices, and defence.The flatness of the two connections determines the reliability of the chip, and it is of great significance for the development of the semiconductor industry to predict and control the change of ceramic flatness after encapsulation.Design of experiments for ceramic-metal brazing based on a high-temperature co-fired ceramic-metal structure using the response surface method to simultaneously investigate the effects of multiple experimental variables on the flatness of ceramic-metal brazing.The change in ceramic flatness before and after brazing was taken as the response value, and a prediction model with quadratic polynomial regression equations was developed using a CCD combinatorial design to investigate the effect of ceramic size and metal size on the change in flatness.The results show that increasing the height of the ceramic or decreasing the length of the ceramic sides and the thickness of the wall reduces the change in flatness.At the same time, the ceramic size has a more significant effect on flatness, while the wall thickness plays a smaller role in affecting flatness. The results provide a reference for the prediction and control of ceramic brazing flatness.
[1] |
张炳渠, 赵平, 戴增荣. 微电子陶瓷封装的金属化技术[J]. 真空电子技术, 2003(4): 41 − 44.
Zhang Bingqu, Zhao Ping, Dai Zengrong. Metalization technology for microelectronic ceramic packaging[J]. Vacuum Electronics, 2003(4): 41 − 44.
|
[2] |
张志庆, 张玉, 刘旭. TO型陶瓷封装外壳可靠性研究[J]. 电子质量, 2022(11): 32 − 36.
Zhang Zhqing, Zhang Yu, Liu Xu. Reliability research on TO-type ceramic packaging shell[J]. Electronic Quality, 2022(11): 32 − 36.
|
[3] |
Li Y, Wang J, Shen Z, et al. Application of Ag–Cu–Ti active metal composite filler in ceramic joining: a review[J]. 材料科学前沿, 2023, 17(4): 230664.
|
[4] |
Wampers H, Sauerzapfe K, Mckean W. Highly leak-tight ceramic-metal assembly for a novel, three-dimensional imaging X-Ray process[J]. Ceramic Forum International, 2021(5/6): 98.
|
[5] |
A F M, B J F A M A, C E C, et al. Thermo-mechanical design optimization of symmetric and non-symmetric sandwich plates with ceramic-metal-ceramic functionally graded core to minimize stress, deformation and mass[J]. Composite Structures, 2021, 276: 114496.
|
[6] |
Chmielewski M, Pietrzak K. Metal-ceramic functionally graded materials – manufacturing, characterization, application[J].Bulletin of the Polish Academy of Sciences Technical Sciences, 2016, 64(1):151
|
[7] |
Tang L, Wang Y, Liang Q, et al. Design and investigation of a high integrated reliable ceramic package for surface mount technology[J]. Microelectronics Journal, 2021(8): 114.
|
[8] |
Pan H. OFC 2022 Expo to feature kyocera's next-generation, high-speed ceramic packages for optoelectronics[J]. Fiber Optics & Communications: Monthly newsletter lovering domestic & international news on fiber optic communications and related fields, 2022(3): 45.
|
[9] |
Xue Z, Tian X, Luan Y, et al. Size effect on heat conduction and associate thermal fracture behavior of thin ceramic plates[J]. Theoretical and Applied Fracture Mechanics, 2021, 113(2): 102951.
|
[10] |
Anton C, Muntean M, Gavrila R, et al. The direct bonding of metals to ceramics for the manufactured microwave packages[C]//Conference & Exhibition of the European Ceramic Society. 2002.
|
[11] |
Chun Hway, Hsueh, Paul, et al. Thermal expansion coefficients of unidirectional fiber-reinforced ceramics[J]. Journal of the American Ceramic Society, 1988, 71(10): 438 − 441.
|
[12] |
Hirata Y. Theoretical analyses of thermal shock and thermal expansion coefficients of metals and ceramics[J]. Ceramics International, 2015, 41(1): 1145 − 1153. doi: 10.1016/j.ceramint.2014.09.042
|
[13] |
Wang H, Singh R N. Thermal shock behaviour of ceramics and ceramic composites[J]. Metallurgical Reviews, 2013, 39(6): 228 − 244.
|
[14] |
谭波. 响应曲面法优化激光打孔工艺参数的研究[D]. 武汉: 华中科技大学, 2011
Tan Bo. Research on the optimization of laser drilling process parameters by response surface method [D]. Wuhan: Huazhong of Science and Technology, 2011.
|
[15] |
Shi L, Wang Y, Zhang Y, et al. Optimization of the preparation process of electrostatic-solution blow spinning nanofiber yarn using response surface methodology:[J]. Textile Research Journal, 2022, 92(21-22): 4437 − 4449. doi: 10.1177/00405175221101179
|
[16] |
Rajabi M, Aboutalebi M R, Seyedein S H, et al. Simulation of residual stress in thick thermal barrier coating (TTBC) during thermal shock: A response surface-finite element modeling[J]. Ceramics International, 2022, 48(4): 5299 − 5311. doi: 10.1016/j.ceramint.2021.11.073
|
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