Interfacial Microstructure and Properties of Diffusion Bonded Joints of Ti₃AlC₂ Ceramic and Ni

The Ti₃AlC₂ ceramic and Ni were successfully joined by diffusion bonding technique. The microstructure and element distribution of the joint were analyzed by SEM and TEM. The diffusion mechanism of Ni and the forming mechanism of joint were investigated. The results show that the enrichment of Ni elements adjacent to the Ti₃AlC₂ ceramic led to a diffusion in the interface, which could promote the formation of joint. The typical interfacial microstructure of the Ni/Ti₃AlC₂ ceramic joint obtained at 900 ℃ for 60 min is Ni/Ni3(Al,Ti)+AlNi2Ti+TiC/Ti₃AlC₂ ceramic. It was found that the shear strength of the joint increased with increasing bonding temperature. When the temperature further elevated, the shear strength dramatically decreases. The maximum shear strength is 94.4 MPa at 900 ℃ for 60 min.