Advanced Search
ZHANG Shiyong, WANG Lifeng, BAI Yuhui, LIU Juan, JIA Keming. Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(8): 124-130. DOI: 10.12073/j.hjxb.2019400220
Citation: ZHANG Shiyong, WANG Lifeng, BAI Yuhui, LIU Juan, JIA Keming. Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(8): 124-130. DOI: 10.12073/j.hjxb.2019400220
shu

Effect of reflow temperature on the shear behavior of BGA solder joints under veneer structure and board-level structure

  • 1.

    Harbin University of Science and Technology, Harbin 150040, China

  • 2.

    Jiamusi University, Jiamusi 154007, China

More Information
  • Received Date: January 14, 2018
    Graphical Abstract
    • Abstract
  • The influence of reflow temperature on the shear mechanical properties of three kinds of solders(Sn3.0Ag0.5Cu, Sn0.3Ag0.7Cu and Sn0.3Ag0.7Cu-0.07La-0.05Ce) under veneer structure and board-level structure was studied by shear experiments. Results shown that the shear strength of the high silver solder joints under veneer structure increased with the increase of reflow temperature, while the shear strength of the low silver solder joints under veneer structure increased firstly and then decreased with the increase of reflow temperature. The shear strength of solder joints under board -level structure increased first and then decrease with the increase of reflow temperature, and the shear strength of low silver solder joints with rare earth elements was the highest. The fracture displacement of solder joints under veneer structure and board-level structure decreased with the increase of reflow temperature. The fracture mode of high silver solder joints under board-level structure are changed from ductile fracture to brittle fracture with the increase of reflow temperature. The fracture mode of low silver solder joints under board-level structure always were ductile fractures with the increase of reflow temperature. The fracture position of low silver solder joints under board-level structure shifted to the direction of the IMC with the increase of reflow temperature.
    • FullText(HTML)
    • References (13)
  • 杜长华,陈方.电子微连接技术与材料[M].北京:机械工业出版社, 2011.
    Braun T, Becker K F, Koch M, et al. High-temperature reliability of flip chip assemblies[J]. Microelectronics Reliability, 2006, 46(1):144-154.
    Huang M L, Loeher T, Ostmann A, et al. Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders[J]. Applied Physics Letters, 2005, 86(18):18-19.
    李炳旺,吴慧. BGA植球工艺技术[J].电子与封装, 2013, 13(6):24-25 Li Bingwang, Wu Hui. The soldering-ball process technology of BGA[J]. Electronics&Packing, 2013, 13(6):24-25
    贾克明,王丽凤,张世勇,等. BGA单板结构与板级结构焊点剪切力学行为分析[J].焊接学报, 2018, 39(3):94-98 Jia Keming, Wang Lifeng, Zhang Shiyong, et al. Analysis of shear mechanical behavior of solder joints in BGA under veneer structure and board-level structure[J]. Transactions of the China Welding Institution, 2018, 39(3):94-98
    Tian Y H, Wang C Q, Zhou W F. Evolution of microstructure of Sn-Ag-Cu lead-free flip chip solder joints during aging process[J]. Acta Metal lurgica Sinica (English Letters), 2006, 19(4):301-306.
    杨丽,霍树斌,王辉亭,等.钎焊温度对TC4与Ti-3Al-Nb合金钎焊接头组织的影响[J].焊接学报, 2006, 27(1):105-108 Yang Li, Huo Shubin, Wang Huiting, et al. Influnce of brazing temperature on microstructure of TC4 and Ti-3Al-Nb alloy brazed joint[J]. Transactions of the China Welding Institution, 2006, 27(1):105-108
    Kim K S, Hub S H, Suganuma K. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J]. Materials Science and Engineering, 2002, 333(1-2):104-114.
    Iver E Anderson. Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-Free electronic solders application[J]. Mater Sci:Mater Electron, 2007, 18:55-76.
    戴文勤,王丽凤,何冰,等. La对Sn-0.3Ag-0.7Cu回流焊点纳米力学性能影响[J].焊接学报, 2015, 36(9):75-78 Dai Wenqin, Wang Lifeng, He Bing, et al. Effect La on nanomechanical properties of Sn-0.3Ag-0.7Cu reflow solder joints[J]. Transactions of the China Welding Institution, 2015, 36(9):75-78
    Shi L, Sun F L, Liu Y, et al. Properties analysis of a new type of solder paste SACBN07[J]. China Welding, 2017(2):11-17.
    Alex C K, Chan Y C. Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints[J]. 1996 Electronic Components and Technology Conference, 1996:1164-1171.
    谷柏松,孟工戈,孙凤莲,等. Sn-3.0Ag-0.5Cu/Ni/Cu微焊点剪切强度与断口的研究[J].电子组件与材料, 2013, 32(3):70-76 Gu Bosong, Meng Gongge, Sun Fenglian., et al Research on micro solder joint shear strength and fracture of Sn-3.0Ag-0.5Cu/Ni/Cu[J]. Electronic Components and Materials, 2013, 32(3):70-76
    • Related Articles

  • Related Articles

    [1]XIE Yuxin, GONG Yefei, GU Xinhao, CHEN Xiaobin, WANG Meng, XU Huigang. Research on weld surface defect detection method based on RGB-D feature fusion[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(12): 72-78. DOI: 10.12073/j.hjxb.20230712002
    [2]GUO Zhongfeng, LIU Junchi, YANG Junlin. Weld recognition based on key point detection method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2024, 45(1): 88-93. DOI: 10.12073/j.hjxb.20230204001
    [3]WANG Rui, HU Yunlei, LIU Weipeng, LI Haitao. Defect detection of weld X-ray image based on edge AI[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 79-84. DOI: 10.12073/j.hjxb.20210516001
    [4]LI Hexi, HAN Xinle, FANG Zaojun. A visual model of welding robot based on CNN deep learning[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 154-160. DOI: 10.12073/j.hjxb.2019400060
    [5]GAO Weixin, HU Yuheng, WU Xiaomeng. A new algorithm for detecting defects of sub-arc welding x-ray image based on compress sensor theory[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 85-88.
    [6]LI Xueqin, LIU Peiyong, YIN Guofu, JIANG Honghai. Weld defect detection by X-ray images method based on Fourier fitting surface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(10): 61-64.
    [7]SHAO Jiaxin, DU Dong, ZHU Xinjie, GAO Zhiling, WANG Chen. Weld defect detection of double sides weld based on X-ray digitized image[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2010, (11): 21-24.
    [8]CHEN Ming, MA Yuezhou, CHEN Guang. Weld defects detection for X-ray linear array real-time imaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (6): 81-84.
    [9]CAI Guorui, DU Dong, TIAN Yuan, HOU Runshi, GAO Zhiling. Defect detection of X-ray images of weld using optimized heuristic search based on image information fusion[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (2): 29-32.
    [10]LIANG De-qun, SHEN San, YANG Hai-jun. Measurement of Deep Sclae on Weld Defects based on Point X-Pay Source[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2000, (3): 5-8.

  • Cited by

    Periodical cited type(19)

    1. 戴铮，刘骁佳，潘泉. 基于CCBFE-RCNN模型的焊缝X射线图像缺陷识别算法. 焊接学报. 2025(01): 24-33 . 本站查看
    2. 简珂，王帅，李强. 基于连通域分析的钢管焊缝缺陷检测方法. 测控技术. 2025(02): 11-17 .
    3. 李闯，马行，穆春阳，刘永鹿，秦政硕，张弘. 改进YOLOv3的轻量级铸件焊缝表面缺陷检测. 组合机床与自动化加工技术. 2024(01): 156-159+163 .
    4. 张婷，王登武. 基于空洞分层注意力胶囊网络的X射线焊缝缺陷识别方法. 宇航计测技术. 2024(02): 45-51 .
    5. 穆春阳，李闯，马行，刘永鹿，杨科，刘宝成. 改进YOLOv7-tiny的轻量化大型铸件焊缝缺陷检测. 组合机床与自动化加工技术. 2024(07): 156-160 .
    6. 傅留虎. 基于轻量化特征增强网络的焊缝缺陷检测方法. 焊接. 2024(07): 38-49+57 .
    7. 李国栋，吴志生，彭甫镕，郝康将，昝晓亮，郭威. 基于有监督对比学习的焊缝缺陷X射线检测方法. 焊接. 2024(07): 7-14 .
    8. 苏志威，黄子涵，邱发生，郭朝阳，殷晓芳，邬冠华. 基于改进YOLOv8的航空铝合金焊缝缺陷检测方法. 航空动力学报. 2024(06): 121-129 .
    9. 宋杰三. 基于改进Yolov8的焊缝缺陷检测研究. 中国设备工程. 2024(14): 196-199 .
    10. 李兴红. 基于深度学习的液氯罐车射线图像缺陷自动识别研究. 中国高新科技. 2024(12): 15-17 .
    11. 张小刚，俞东宝，汤慧，朱永利. 基于深度学习的X射线燃料棒端塞缺陷自动检测方法研究. 原子能科学技术. 2024(08): 1767-1776 .
    12. 贾韶辉，李亚平，高炜欣，彭云超，张新建，王玉霞. 基于X射线图像与稀疏描述的管道环焊缝缺陷自动识别法. 油气储运. 2024(09): 1048-1055+1079 .
    13. 张睿，李吉. 多级多尺神经网络自搜索的焊缝缺陷语义分割. 计算机辅助设计与图形学学报. 2024(11): 1750-1760 .
    14. 谢雨欣，龚烨飞，谷心浩，陈晓彬，王萌，徐惠钢. 基于RGB-D特征融合的焊缝表面缺陷检测方法. 焊接学报. 2024(12): 72-78 . 本站查看
    15. 张睿，高美蓉，傅留虎，张鹏云，白晓露，赵娜. 基于多域多尺度深度特征自适应融合的焊缝缺陷检测研究. 振动与冲击. 2023(17): 294-305+313 .
    16. 郑孝干，杨毅豪，林啸，吕雷，肖毓勇，黄潞璐. 基于AI的输电线路导线断散股缺陷检测方法. 电工技术. 2023(20): 69-71+74 .
    17. 田伟倩，朱华兵，张淋，胡斌. 基于卷积神经网络的工业缺陷检测研究进展. 中国特种设备安全. 2023(12): 1-7 .
    18. 邓智超，颜润明，杨蕙同，陈浩林，赖锦祥，雷亮. 基于改进残差网络的多视图焊点缺陷检测. 焊接学报. 2022(03): 56-62+116 . 本站查看
    19. 杨国威，张金丽. 基于光栅投影的焊后焊缝表面三维测量. 焊接学报. 2022(04): 100-105+112+119-120 . 本站查看

    Other cited types(17)

Catalog

    Get Citation
    PDF
    XML
    Article views (510) PDF downloads (63) Cited by(36)
    Turn off MathJax
    Article Contents
    Abstract
    References
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return