Citation: | LI Yang, LI Xiaoyan, YAO Peng. Effect of vacancy on the elements diffusion in Cu/Sn lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(12): 25-30. DOI: 10.12073/j.hjxb.2018390292 |
Yin L, Borgesen P. On the root cause of kirkendall voiding in Cu3Sn[J]. Journal of Materials Research, 2011, 26(3): 455 ? 466.
|
Kim J Y, Yu J, Kim S H. Effects of sulfide-forming element additions on the kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints[J]. Acta Materialia, 2009, 57(17): 5001 ? 5012.
|
杨 扬, 陆 皓, 余 春, 等. 锌对SnxZn/Cu界面微空洞的影响[J]. 焊接学报, 2013, 34(1): 53 ? 56
Yang Yang, Lu Hao, Yu Chun, et al. Effect of Zn on formation of voids on Snx Zn/Cu interface[J]. Transactions of the China Welding Institution, 2013, 34(1): 53 ? 56 |
Bhedwar H C, Ray K K, Kulkarni S D, et al. Kirkendall effect studies in copper-tin diffusion couples[J]. Scripta Metallurgica, 1972, 6(10): 919 ? 922.
|
Onishi M, Fujibuchi H. Reaction-diffusion in the Cu-Sn system[J]. Transactions of the Japan Institute of Metals, 1975, 16(9): 539 ? 547.
|
Tu K N, Thompson R D. Kinetics of interfacial reaction in bimetallic Cu Sn thin films[J]. Acta Metallurgica, 1982, 30(5): 947 ? 952.
|
Oikawa H, Hosoi A. Interdiffusion in Cu Sn solid solutions. confirmation of anomalously large kirkendall effect[J]. Scripta Metallurgica, 1975, 9(8): 823 ? 828.
|
Hoshino K, Iijima Y, Hirano K. Interdiffusion and kirkendall effect in Cu-Sn alloys[J]. Transactions of the Japan Institute of Metals, 1980, 21(10): 674 ? 682.
|
杨 扬. Sn基钎料/Cu界面柯肯达尔空洞机理研究[D]. 上海: 上海交通大学, 2012.
|
Baskes M I. Modified embedded-atom potentials for cubic materials and impurities[J]. Physical Review B, 1992, 46(5): 2727 ? 2742.
|
Cheng H C, Yu C F, Chen W H. Strain-and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation[J]. Journal of Materials Science, 2012, 47(7): 3103 ? 3114.
|
Pankratov O, Huang H, Tomas DDLR, et al. As-vacancy interaction and ring mechanism of diffusion in Si[J]. Physical Review B, 1997, 56(20): 13172 ? 13176.
|
Kushima A, Parfitt D, Chroneos A, et al. Interstitialcy diffusion of oxygen in tetragonal La2CoO4+δ[J]. Physical Chemistry Chemical Physics, 2011, 13(6): 2242 ? 2249.
|
Zhang J, Song X, Zhang X, et al. The properties and structures of the mono-and the di-vacancy in Cu crystal[J]. Journal of Physics and Chemistry of Solids, 2006, 67(4): 714 ? 719.
|
Shang P J, Liu Z Q, Pang X Y, et al. Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates[J]. Acta Materialia, 2009, 57(16): 4697 ? 4706.
|
Wang Y W, Lin Y W, Kao C R. Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders[J]. Journal of Alloys and Compounds, 2010, 493(1): 233 ? 239.
|
Akbarzadeh A R, Chen Z Z, Kioussis N. Crucial role of surface in stability and mobility of vacancy clusters in metals[J]. Physical Review B, 2009, 79(19).
|
Yuan X J, Chen N X, Shen J, et al. Embedded-atom-method interatomic potentials from lattice inversion[J]. Journal of Physics: Condensed Matter, 2010, 22(37): 375503.
|
Gao F, Qu J. Calculating the diffusivity of Cu and Sn in Cu3Sn intermetallic by molecular dynamics simulations[J]. Materials Letters, 2012, 73: 92 ? 94.
|
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[2] | ZHANG Liang, YANG Fan, GUO Yonghuan, ZHONG Sujuan, MA Jia, BAO Li. Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(7): 1-4. |
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[7] | WANG Jian-xin, XUE Song-bai, HUANG Xiang, HAN Zong-jie, YU Sheng-lin. Effects of N2 protection on wettability of Sn-Cu-Ni-Ce lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (1): 49-52. |
[8] | WANG Jian-xin, XUE Song-bai, HAN Zong-jie, WANG ning, YU Sheng-lin. Effects of temperature and coatings on wettability of Sn-Cu-Ni lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2006, (10): 53-56. |
[9] | WANG Xu-yan, XUE Song-bai, YU Sheng-lin, ZHU Xiao-jun. Effects of temperature and coatings on wettability of Sn-Ag-Cu lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 93-96. |
[10] | XUE Song-bai, LIU Lin, DAI Yong-feng, YAO Li-hua. Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 23-26. |
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