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XU Dongxia1, FAN Xiaojie2, XU Guoxing1, DING Lianzheng1, CHEN Sijie1, NIU Jitai3. Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(7): 125-128. DOI: 10.12073/j.hjxb.2018390189
Citation: XU Dongxia1, FAN Xiaojie2, XU Guoxing1, DING Lianzheng1, CHEN Sijie1, NIU Jitai3. Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(7): 125-128. DOI: 10.12073/j.hjxb.2018390189
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Effect of soldering time on interface IMC growth of nickel-plated SiCP/Al composites

  • 1. Department of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454003, China;
    2. Guizhou University of Engineering Science, Bijie 551700, China;
    3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

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  • Received Date: March 16, 2017
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    • Abstract
  • SiCp/6063Al composites containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum. The microstructure and components of the interface were studied by means of SEM and XRD. The results show that in the soldering process, the solder reacts with the nickel layer and continuous scalloped intermetallic compound forms at the interface and the IMC is (Cu, Ni)6Sn5. The IMC layer is arranged compact and its growth direction perpendicular to the interface point to solder. In the soldering process, the growth of IMC can be divided into a faster growth rate stage and a slower growth rate stage. At the soldering temperature of 270℃, when soldering time is extended from 10 min to 40 min, scallop-shaped morphology of IMC keeps unchanged, the grain of IMC becomes larger. Thickness of IMC layer increases, but its growth rate is gradually reduced with increasing soldering time. The shear strength of the soldered joint improves continuously.
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    • References (11)
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