Study on interface diffusion bonding of ZChSnSb11-6 alloy and tin plating steel

In the paper, on the basis of the theory of atomic diffusion, ZChSnSb11-6/30CrMnSi bimetal composite material was prepared by means of hot dipping tin plating as intermediate transition layer. The transition zone morphology and element distribution of ZChSnSb11-6/30CrMnSi bimetallic material were characterized by a scanning electron microscope (SEM) equipped with an energy disperse spectroscopy (EDS). Also, the hardness and interface bonding strength were tested. The research results prove the functionality and availability of the method using the hot dipping tin to attach the ZChSnSb11-6 with 30CrMnSi. There is a transition area generated by the diffusion between the steel substrate and the middle layer tin, and the thickness of the transition area increases significantly with the increasing of tin plating temperature. Besides, the hardness of transition zone is significantly higher than both sides of the substrate. Interface bonding strength increased with the increasing of tin plating temperature, and peaks arrived to 60.6 MPa at 900℃.