Advanced Search
ZHAO Zhili, LIU Yingjie, SONG Lairui. Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
Citation: ZHAO Zhili, LIU Yingjie, SONG Lairui. Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
shu

Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure

More Information
  • Received Date: December 06, 2016
    Graphical Abstract
    • Abstract
  • The mechanical behavior of CuCGA interconnection structure under axial compression load was studied using finite element method. The results showed that tensile stress exceeded tensile strength and microcrack occurred in local area of soldering fillet before buckling instability for soldered Cu column with the diameter of 0.32 mm and aspect ratio range from 5 to 11.5. Buckling instability first occurred for Cu column with the diameter of 0.32 mm and aspect ratio range from 11.5 to 16.5. The relation equation between aspect ratio of Cu column and the critical stress of soldered Cu column interconnection under axial compressive loading was established based on comprehensive consideration of microcrack failure in soldering fillet and buckling failure. The axial critical compressive stress was nearly constant for aspect ratio of Cu column in the range of 5～11.5, while decreased with the increase of Cu column aspect ratio between 11.5～16.5. The relationship between axial critical compressive stress and aspect ratio of Cu column was consistent with the Euler formula which is used to describe large flexibility rod.
    • FullText(HTML)
    • References (1)
  • Park S B, Rahul Joshi. Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages[J]. Microelectronics Reliability, 2008, 48: 763-772.[2] Ghaffarian R. CCGA packages for space applications[J]. Microelectronics Reliability, 2006, 46: 2006-2024.[3] Ghaffarian R. Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking[J].IEEE Transactions on Components and Packaging Technologies, 2008, 31(2): 285-296.[4] Lau J, Dauksher W. Reliability of an 1657CCGA (ceramic column grid array) package with Sn3.9Ag0.6Cu lead-free solder paste on PCBs)[J]. Journal of Electronic Packaging, 2005, 127: 97-105.[5] 赵智力, 徐希锐, 孙凤莲, 等. 铜柱栅阵列互连结构的剪切行为[J]. 焊接学报, 2015, 36(4)： 79-82.Zhao Zhili， Xu Xirui， Sun Fenglian，et al. Shear behavior of copper column grid array interconnect structure[J]. Transactions of the China Welding Institution, 2015, 36(4)： 79-82.[6] 徐希锐. 剪切载荷下面阵列封装互连结构的力学行为研究[D]. 哈尔滨： 哈尔滨理工大学, 2015.[7] Cillian Burke, Jeff Punch. A comparision of the creep behaviour of joint scale SAC105 and SAC305 solder samples under shear conditions[C]∥13th Internationl Conference on Thermal, Mechanical and Multi-physics Simulations and Experiments in Microelectronics and Microsystems Cascais, Portugal, 2012: 16-18.[8] 肖正香, 薛松柏, 金春玉, 等. CuCGA器件焊点热疲劳行为数值模拟[J]. 焊接学报, 2009, 30(12): 77-81.Xiang Zhengxiang, Xue Songbai, Jin Chunyu,et al. Numerical simulation on thermal fatigue behavior of CuCGA soldered joints[J]. Transactions of the China Welding Institution, 2009, 30(12): 77-81.[9] 皋利利, 薛松柏, 张 亮， 等. CCGA元器件焊柱可靠性影响的有限元分析[J]. 焊接学报, 2008, 29(7): 93-96.Gao Lili, Xue Songbai, Zhang Liang,et al. Finite element analysis on influencing factors of soldered column reliability in a CCGA device[J]. Transactions of the China Welding Institution, 2008, 29(7): 93-96.[10] 陈 明, 张秋华, 严 勇, 等. 测量压杆临界压力的理论与实验[J]. 力学与实践, 2007, 29： 74-76.Chen Ming, Zhang Qiuhua, Yan Yong,et al. Theories and experiments of measuring the critical pressure for a slender compressed rod[J]. Mechanics in Engineering, 2007, 29： 74-76.
    • Related Articles

  • Related Articles

    [1]XUE Bin, ZHANG Tianhui, XU Renping, WANG Shiyue. Effect of residual compressive stress field on fatigue crack growth of B780CF steel welded joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(6): 103-108.
    [2]ZHAO Zhili, XU Xirui, SUN Fenglian, YANG Jianguo. Shear behavior of copper column grid array interconnect structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(4): 79-82.
    [3]LU Hao. Instable acoustic elasticity phenomenon in welding residual stress field[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(2): 105-108.
    [4]LIU Bin, DONG Shiyun. Stress measurement of laser cladding coating with critically refracted longitudinal wave method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(9): 53-56.
    [5]ZHANG Yong, YANG Jianguo, FANG Hongyuan. Calculation of impacting rotation compression stress during TC4 welding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (9): 89-92.
    [6]CHENG Guangfu, WANG Huiting, JI Shude, FANG Hongyuan. Optimizing of compressive stress region by local treatment technologies on Francis runner[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (8): 97-100.
    [7]CHENG Guangfu, GUO Jie, JI Shude, FANG Hongyuan. Welding process optimization and local compressive stress realization of francis runner[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (7): 37-40.
    [8]LI Liangbi, WAN Zhengquan, PAN Guangshan, WANG Zili. Different internal pressure influence on welding residual stresse of cone-cylinder pressure shell structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (10): 29-32.
    [9]HONG Liling, XIN Xuanrong, ZHANG Keke, LIU Ting, WANG Wenyan. Experimental study on compression-diffusion composite connection of Cu/Al joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (1): 85-88.
    [10]Yu Junchuan, Zhang Youwei, Ruan Guoyu. Effect of welding heat input on critical implant stress of 15MnVN steel[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 1992, (4): 245-250.

Catalog

    Get Citation
    XML
    Article views (518) PDF downloads (0) Cited by()
    Turn off MathJax
    Article Contents
    Abstract
    References
    Related Articles

    Website Copyright © Editorial Office of Transactions of the China Welding Institution, Welding Journals Publishing HouseTel：0451-86323218Address：No. 2077, Chuangxin Road, Songbei District, Harbin

    Supported by: Beijing Renhe Information Technology Co. Ltd    Baidu Analytics

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return