Advanced Search
CUI Haipo, CHENG Enqing. Random vibration analysis of different electronic packaging structures[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(7): 91-94. DOI: 10.12073/j.hjxb.20150606002
Citation: CUI Haipo, CHENG Enqing. Random vibration analysis of different electronic packaging structures[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(7): 91-94. DOI: 10.12073/j.hjxb.20150606002

Random vibration analysis of different electronic packaging structures

More Information
  • Received Date: June 05, 2015
  • The stress fields in two kinds of packaging structures on a Printed Circuit Board (PCB) under random vibration loading were analyzed based on finite element analysis (FEA) software ABAQUS. The properties of different packaging structures were compared. The results indicate that, under random vibration loading, the nearer the edge of PCB, the higher the stress. Under the same conditions, the stress in PBGA was higher than that in QFP. For the same kind of packaging, the components whose stress were at least 10% lower than the maximum stress were non-weak components, and the others were weak components. According to this definition, QFP-1 and QFP-5 are weak components for 5 sets of QFP, while PBGA-3 is non-weak component for 5 sets of PBGA.
  • 尹立孟,Michael P,位 松,等.焊点高度对微尺度焊点力学行为的影响[J].焊接学报,2013,34(8): 27-34. Yin Limeng,Michael P,Wei Song,etal.Effect of joint height on the mechanical behaviors of micro-scale solder joints[J].Transactions of the China Welding Institution,2013,34(8): 27-34.[2] Chawla N.Thermal fatigue behavior of Sn-rich (Pb-free) solders[J].Metallurgical and Materials Transactions A,2008,39 (4): 799-810.[3] Ubachs R,Schreurs P,Geers M.Elasto-viscoplastic nonlocal damage modeling of thermal fatigue in anisotropic lead-free solder[J].Mechanics of Materials,2007,39(7): 685- 701.[4] 吴卫华,肖 勇.热循环条件下无铅焊点可靠性的有限元分析[J].电子产品可靠性与环境试验,2010,28(6): 42-45.Wu Weihua,Xiao Yong.FEM Analysis of effect of thermal cycling on the reliability of lead-free soldered joint[J].Electronic Product Reliability and Environmental Testing,2010,28(6): 42-45.[5] 韦何耕,黄春跃,梁 颖,等.热循环加载条件下 PBGA 叠层无铅焊点可靠性分析[J].焊接学报,2013,34(10): 91-95.Wei Hegeng,Huang Chunyue,Liang Ying,etal.Reliability analysis of plastic ball grid array double-bump lead-free solder joint under thermal cycle[J].Transactions of the China Welding Institution,2013,34(10): 91-95.[6] 周 新,刘 芳,周海亭,等.无铅焊点在跌落冲击载荷下动态特性研究[J].噪声与振动控制,2007,24(4): 1-3.Zhou Xin,Liu Fang,Zhou Haiting,etal.Dynamic study of lead-free solder Joint under drop impact[J].Noise and Vibration Control,2007,24(4): 1-3.[7] Wong E H,Mai Y W,Seah S K W.Board level drop impact fundamental and parametric analysis[J].Journal of Electronic Packaging 2005,127(4): 496-502.[8] Tee T Y,Hun S N,Lim C T,etal.Impact life prediction modeling of TFBGA Packages under board level drop test[J].Microelectronics Reliability,2004,44(7):1131-1142.[9] Lai Y S,Wang T H.Optimal design towards enhancement of board-level thermal mechanical reliability of wafer-level chip scale packages[J].Microelectronics Reliability,2007,47(1):104-110.[10] Vandevelde B,Degryse D,Beyne E,etal.Modified micro macro thermo-mechanical modeling of ceramic ball grid array packages[J].Microelectronics Reliability,2003,43(2): 307-318.[11] Wang Z Q,Song J.Equivalent linearization method using Gaussian mixture (GM-ELM) for nonlinear random vibration analysis[J].Structural Safety,2017,64(1): 9-19.[12] Hu Z Q,Su C,Chen T C,etal.An explicit time-domain approach for sensitivity analysis of non-stationary random vibration problems[J].Journal of Sound and Vibration,2016,382(10): 122-139.[13] Kim Y K,Hwang D S.PBGA packaging reliability assessments under random vibrations for space applications [J].Microelectronics Reliability,2015,55(1): 172-179.[14] Liu F,Lu Y,Wang Z,etal.Numerical simulation and fatigue life estimation of BGA packages under random vibration loading [J].Microelectronics Reliability,2015,55(12): 2777-2785.[15] 崔海坡,程恩清.不同结构参数下QFP封装的随机振动分析[J].焊接学报,2015,36(11): 21-24.Cui Haipo,Cheng Enqing.Random vibration analysis of QFP with different structure parameters[J].Transactions of the China Welding Institution,2015,36(11):21-24.
  • Related Articles

    [1]LIU Xudong, SA Zicheng, FENG Jiayun, LI Haozhe, TIAN Yanhong. The Development Status On Advanced Packaging Copper Pillar Bump Interconnection Technology and Reliability[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION. DOI: 10.12073/j.hjxb.20240718001
    [2]YANG Dongsheng, ZHANG He, FENG Jiayun, SA Zicheng, WANG Chenxi, TIAN Yanhong. Research progress on micro/nano joining technologies and failure behaviors in electronic packaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 126-136. DOI: 10.12073/j.hjxb.20220702003
    [3]SUN Lei, ZHANG Yi, CHEN Minghe, ZHANG Liang, MIAO Naiming. Finite element analysis of solder joint reliability of 3D packaging chip[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(1): 49-53. DOI: 10.12073/j.hjxb.20201021002
    [4]YANG Hong, LI Yulong, DONG Yangping, CUI Qingbo. Ultrasonic welding packaging of FBG and its bending sensing characteristics[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(8): 69-75. DOI: 10.12073/j.hjxb.2019400211
    [5]HAN Lishuai, HUANG Chunyue, LIANG Ying, KUANG Bing, HUANG Genxin. Analysis of stress strain and shape size optimization of 3D micro-scale CSP solder joints in random vibration[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(6): 64-70. DOI: 10.12073/j.hjxb.2019400156
    [6]XIONG Mingyue1, ZHANG Liang1,2, LIU Zhiquan2, YANG Fan1, ZHONG Sujuan3, MA Jia3, BAO Li3. Structure optimization design of CSP device based on Taguchi method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(5): 51-54. DOI: 10.12073/j.hjxb.2018390121
    [7]CUI Haipo, CHENG Enqing. Random vibration analysis of different electronic packaging structures[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(7): 91-94. DOI: 10.12073/j.hjxb.20150606002
    [8]NAN Qiuming, WU Haoying, LI Sheng. Metallization packaging method for FBG vibration sensor[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(2): 17-20.
    [9]WANG Bo, MO Liping, WU Fengshun, XIA Weisheng, WU Yiping. Microstructure of solder joints with micron stand-off height in electronic packaging[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 25-28.
    [10]YE Huan, XUE Songbai, ZHANG Liang, WANG Hui. Finite element analysis on reliability of lead-free soldered joints for CSP device[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (11): 93-96.
  • Cited by

    Periodical cited type(1)

    1. 蒋宝,徐富家,杨义成,聂鑫,宋扬,刘孔丰. 万瓦级激光-电弧复合穿透焊接成形缺陷研究. 电焊机. 2022(10): 15-22 .

    Other cited types(1)

Catalog

    Article views (404) PDF downloads (120) Cited by(2)

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return