Abstract: Random vibration responses of QFP with different structure parameters were analyzed based on the ABAQUS software. The stress distributions of whole packaging and solder joints were obtained. The influence regularities of different lead widths, lead distances and lead heights on the stress field of QFP have been studied. The results indicate that, under the random vibration loading, the solder joints are weak components of QFP. The maximum stress focuses on the sharp corner of exterior part of the solder joints. Stress concentration areas locate at that position and the junction of lead with solder joint, which will be the most likely failure regions. The maximum stress of QFP is in direct proportion to the distance and height of lead and in inverse proportion to the width of lead.