不同结构参数下QFP封装的随机振动分析
Random vibration analysis of QFP with different structure parameters
-
摘要: 基于ABAQUS软件,对不同结构参数下QFP封装的随机振动响应进行了分析,获取了整体封装结构及焊点阵列的应力分布云图,并研究了引线宽度、引线间距、引线高度等不同参数对QFP封装器件应力场的影响规律. 结果表明,在随机振动载荷下,QFP封装器件的焊点阵列为整体结构的薄弱环节,且最大应力位置出现在焊趾部位,即焊点最外侧的尖角处;在焊点的焊趾部位以及引线与焊点交界处存在明显的应力集中现象,上述两处将成为焊点最可能发生破坏的区域;QFP封装器件的最大应力值与引线间距和引线高度成正比,与引线宽度成反比.Abstract: Random vibration responses of QFP with different structure parameters were analyzed based on the ABAQUS software. The stress distributions of whole packaging and solder joints were obtained. The influence regularities of different lead widths, lead distances and lead heights on the stress field of QFP have been studied. The results indicate that, under the random vibration loading, the solder joints are weak components of QFP. The maximum stress focuses on the sharp corner of exterior part of the solder joints. Stress concentration areas locate at that position and the junction of lead with solder joint, which will be the most likely failure regions. The maximum stress of QFP is in direct proportion to the distance and height of lead and in inverse proportion to the width of lead.
-
Keywords:
- random vibration /
- quad flat packaging /
- influence regularities /
- solder joint
-
-
[1] 韦何耕, 黄春跃, 梁 颖, 等. 热循环加载条件下 PBGA叠层无铅焊点可靠性分析[J]. 焊接学报, 2013, 34(10): 91-95. Wei Hegeng, Huang Chunyue, Liang Ying, et al. Reliability analysis of plastic ball grid array double-bump lead-free solder joint under thermal cycle[J]. Transactions of the China Welding Institution, 2013, 34(10):91-95. [2] Chawla N. Thermal fatigue behavior of Sn-rich (Pb-free) solders[J]. Metallurgical and Materials Transactions A, 2008, 39A: 799-810. [3] 尹立孟, Michael P, 位 松, 等. 焊点高度对微尺度焊点力学行为的影响[J]. 焊接学报, 2013, 34(8): 27-34. Yin Limeng, Michael P, Wei Song, et al. Effect of joint height on the mechanical behaviors of micro-scale solder joints[J]. Transactions of the China Welding Institution, 2013, 34(8): 27-34. [4] Ubachs R, Schreurs P, Geers M. Elasto-viscoplastic nonlocal damage modeling of thermal fatigue in anisotropic lead-free solder[J]. Mechanics of Materials, 2007, 39(7): 685-701. [5] 王 欢, 杨 平, 谢方伟, 等. 复合加载下焊点寿命的数值模拟[J].焊接学报, 2012, 33(12): 65-68. Wang Huan, Yang Ping, Xie Fangwei, et al. Study on life-prediction of solder joint under combined loading[J]. Transactions of the China Welding Institution, 2012, 33(12): 65-68. [6] Tan V B C, Tong M X. Finite element modeling of electronic packages subjected to drop impact[J]. IEEE Transactions on Components and Packaging Technologies, 2005, 28(3): 555-560. [7] Lai Y S, Wang T H. Optimal design towards enhancement of board-level thermal mechanical reliability of wafer-level chip scale packages[J]. Microelectronics Reliability, 2007, 47(1): 104-110. [8] Vandevelde B, Degryse D, Beyne E, et al. Modified micro macro thermo-mechanical modeling of ceramic ball grid array packages[J]. Microelectronics Reliability, 2003, 43(2): 307-318. [9] Lim C T, Teo Y M, Shim V P W. Numerical simulation of the drop impact response of a portable electronic product[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(3): 478-485. [10] 盛 重. QFP焊点可靠性研究及其热循环疲劳寿命预测[D]. 南京: 南京航空航天大学, 2010. [11] 林家浩, 张亚辉. 随机振动的虚拟激励法[M]. 北京:科学出版社, 2004. -
期刊类型引用(7)
1. 于江，杜荣茂，范彦龙，葛福琛，余果，张洪涛，杨涛. 冷喷涂Cu涂层辅助铝/钢异种金属电阻热扩散连接工艺分析. 焊接学报. 2024(12): 36-44 . 
本站查看
2. 肖勇，程钊，周建军，张建，罗丹，李明雨. 铝合金表面电弧喷涂Ag基涂层及其低温钎焊行为. 焊接学报. 2022(12): 27-34+114 . 本站查看
3. 徐杰，王田. 焊接电流对镁合金/不锈钢电阻点焊接头的影响. 热加工工艺. 2019(01): 214-216 . 百度学术
4. 李文亚，曹聪聪，杨夏炜，徐雅欣. 冷喷涂复合加工制造技术及其应用. 材料工程. 2019(11): 53-63 . 百度学术
5. 张梦清，乔玉林，张仲，张伟，于鹤龙. 铜合金表面冷喷涂纯Cu/Cu基复合涂层的结构与性能. 科技经济导刊. 2019(31): 34+36 . 百度学术
6. 汤贵庭. 镁/钢异种金属电阻点焊工艺研究. 热加工工艺. 2018(15): 225-228 . 百度学术
7. 贾林，栗卓新，李红，Wolfgang Tillmann. 中间层对可伐合金4J29/钼组玻璃DM308激光焊接接头结合性能的影响. 焊接学报. 2018(11): 33-38+130 . 本站查看
其他类型引用(7)
计量
- 文章访问数: 550
- HTML全文浏览量: 29
- PDF下载量: 204
- 被引次数: 14
下载:
