面阵列封装互连结构热循环翘曲变形抗力
Resistance to warpage deformation of area array packaging interconnect under thermal cyclic load
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摘要: 借助有限元软件对钎料球、钎料柱和铜柱阵列互连结构热循环载荷下的翘曲变形行为进行研究. 结果表明,三者升温过程均表现为刚度低的树脂基板呈下凹变形、而降温至0 ℃后呈现上凸变形,变形规律相同. 不同温度下两端基板的热膨胀系数差异引发的基板内及相连焊球/焊柱内的应力及力矩是翘曲变形发生的驱动力. 两焊柱阵列互连的基板翘曲位移接近,但均明显低于焊球阵列的基板,翘曲变形抗力更大. –40~125 ℃热循环温度范围及基板尺寸条件下,铜柱未屈服,相对钎料柱阵列互连,未表现铜柱可挠曲变形释放应力的优势.Abstract: The warpage behaviors of solder ball array interconnect, solder column array interconnect and copper column array interconnect structures under thermal cycling load were studied by finite element software. The results show that the warpage deformations of three kinds of area array interconnects is the same, the resin substrates with low stiffness exhibit a concave deformations during the heating stage above room temperature, while the convex deformation occurs after cooling to 0 °C. The stress and torque in the substrates and the ball /column array interconnects caused by the difference of thermal expansion coefficients of both ends substrates at different temperatures are the driving forces of warping. The resin substrates of the solder/copper column array interconnect have similar warpage displacements, but both of them are obviously lower than the substrates of solder ball array interconnect, and the warpage deformation resistance is higher. Under the thermal cycling temperature range from –40 °C to 125 °C and given substrate size condition, the yielding deformation of the copper column has not occurred. Comparison with the solder column array interconnect, the advantage of releasing stress by flexural deformation of the copper column is not exhibit.
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[1] Reza G. CCGA packages for space applications[J]. Micro- Electronics Reliability, 2006, 46: 2006 ? 2024. [2] Nikhil V, Peter R, Valérie E, et al. Environment and usage monitoring of electronic products for health assessment and product design[J]. Quality Technology and Quantitative Management, 2007, 4(2): 235 ? 250. [3] Park S. Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages[J]. Microelectronics Reliability, 2008, 48: 763 ? 772. [4] 陈莹磊. 高密度大尺寸 CCGA 二级封装可靠性分析及结构设计[D]. 哈尔滨: 哈尔滨工业大学, 2010. [5] 肖正香, 薛松柏, 金春玉, 等. CuCGA器件焊点热疲劳行为数值模拟[J]. 焊接学报, 2009, 30(12): 77 ? 81
Xiao Zhengxiang, Xue Songbai, Jin Chunyu, et al. Numerical simulation on thermal fatigue behavior of CuCGA soldered joints[J]. Transactions of the China Welding Institution, 2009, 30(12): 77 ? 81[6] 赵智力, 徐希锐, 孙凤莲, 等. 铜柱栅阵列互连结构的剪切行为[J]. 焊接学报, 2015, 36(4): 79 ? 82
Zhao Zhili, Xu Xirui, Sun Fenglian, et al. Shear behavior of copper column grid array interconnect structure[J]. Transactions of the China Welding Institution, 2015, 36(4): 79 ? 82[7] 刘英杰. 铜柱栅阵列互连结构压曲失稳力学行为研究[D]. 哈尔滨: 哈尔滨理工大学, 2017. -
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