[1] |
Deng D A, Shoichi K. Numerical simulation of welding temperature field, residual stress and deformation induced by electro slag welding[J]. Computational Materials Science, 2012, 62(9): 23-34.
|
[2] |
Chen C C, Liang Y C. The effects of electro slag welding on material properties of box column plates[J]. International Steel Structures, 2011, 11(2): 171-189.
|
[3] |
孙加民, 蔡建鹏, 叶延洪, 等. 电渣焊接头的温度场数值模拟[J]. 焊接学报, 2015, 36(7): 93-96. Sun Jiamin, Cai Jianpeng, Ye Yanhong, et al. Numerical simulation of welding temperature field induced by electro slag welding[J]. Transactions of the China Welding Institution, 2015, 36(7): 93-96.
|
[4] |
朱政强, 陈立功, 饶德林, 等. 振动调制工艺在高炉用钢电渣焊中的应用[J]. 焊接学报, 2005, 26(2): 73-76. Zhu Zhengqiang, Chen Ligong, Rao Delin, et al. Experimental study on eleetro slag weld of blast furnace steel using vibratory condition technology[J]. Transactions of the China Welding Institution, 2005, 26(2): 73-76.
|
[5] |
Kitani Y, Ikeda R, Ono M, et al. Improve of welding metal toughness in high input electro slag welding of low carbon steel[J]. Welding in the world, 2009, 53(2): 63-66.
|
[6] |
Kojima A, Yoshii K, Hada T, et al. Development of high HAZ toughness steel plates for box columns with high input welding[J]. Nippon Steel Technical Report, 2004, 38(2): 33-37.
|
[7] |
Deng D A, Sun J M, Dai D P, et al. Influence of accelerated cooling condition on welding thermal cycle, residual stress, and deformation in SM490A steel ESW joint[J]. Journal of Materials Engineering and Performance, 2015, 24 (9): 3487-3501.
|
[8] |
Marc Software Corporation. MSC. marc introductory course[M]. USA: Arcadia Publication, 2005.
|
[9] |
叶延洪, 孙加民, 蔡建鹏, 等. 焊缝屈服强度对SM490A钢焊缝残余应力预测精度的影响[J]. 焊接学报, 2015, 36(7): 17-20. Ye Yanhong, Sun Jiamin, Cai Jianpeng, et al. Influence of yield strength of weld metal on prediction accuracy of welding residual stress in SM490A steel joint[J]. Transactions of the China Welding Institution, 2015, 36(7): 17-20.
|
[10] |
Hayato S. Construction of heat treatment database and enhancement of simulation technique[J]. Technical Paper, 2005, 155(51): 1-9.
|