A study on Cu-Sn soldering and shear behavior of solder joints with micro interconnection
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摘要: 针对Cu-Sn-Cu三明治结构，进行0.06 MPa恒压钎焊. 基于Cu-Sn二元相图，选定了不同的钎焊温度与钎焊时间. 钎焊完成后，根据不同相组成可将接头分为残余锡，Cu3Sn-Cu6Sn5-Cu3Sn，Cu-Cu3Sn-Cu三类. 为研究三种不同相组成接头抗剪强度之间的关系，进行1 mm/min加载速率的剪切试验，并对断口进行形貌分析. 结果表明，随着Sn与Cu6Sn5相继耗尽，接头抗剪强度不断升高. 残余锡接头，Cu3Sn-Cu6Sn5-Cu3Sn接头，Cu-Cu3Sn-Cu接头抗剪强度分别为23.26，33.59，51.83 MPa. 分析断口形貌发现，在残余Sn接头断口中，可以分辨出Sn，Cu6Sn5，Cu3Sn形貌，说明其断裂路径穿过了Cu6Sn5与Cu3Sn两相. 在Cu3Sn-Cu6Sn5-Cu3Sn接头断口中，可分辨出Cu6Sn5，Cu3Sn形貌，其断裂路径穿过了Cu3Sn相. 全Cu3Sn相接头断口中仅可分辨出Cu3Sn相断裂形貌.Abstract: This study focuses on the Cu-Sn-Cu sandwich structure soldering, 0.06 MPa constant pressure. Different soldering temperatures and soldering times were selected based on the Cu-Sn binary phase diagram. After soldering according to different phase composition the solder joints can be divided into three types of residual Sn/Cu3Sn-Cu6Sn5-Cu3Sn/Cu-Cu3Sn-Cu. The relationship among shear strength of solder joints and three different phases compositions were researched by shear experiment of 1 mm/min loading rate and fracture morphology analysis. The results show that the shear strength of solder joints increases with the depletion of Sn and Cu6Sn5 in sequence. The shear strength of residual Sn solder joints, Cu3Sn-Cu6Sn5-Cu3Sn solder joints and Cu-Cu3Sn-Cu solder joints are 23.26, 33.59, 51.83 MPa, respectively. Based on the fracture morphology analysis, residual Sn solder joint fracture can distinguish the morphology of Sn/Cu6Sn5/Cu3Sn, indicating that the crack path through the Cu6Sn5 and Cu3Sn phases. In Cu3Sn-Cu6Sn5-Cu3Sn solder joint fracture, Cu6Sn5/Cu3Sn morphology was distinguished, crack path through the Cu3Sn phase. When only Cu3Sn phase was at solder joints, was Cu3Sn only Cu3Sn can be seen in fracture morphology of the soldering joints.
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Keywords:
- Cu-Sn interface /
- soldering /
- shear behavior /
- micro interconnection
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