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铜柱长径比对CuCGA互连结构轴向临界压应力的影响

赵智力,刘英杰,宋来瑞

赵智力,刘英杰,宋来瑞. 铜柱长径比对CuCGA互连结构轴向临界压应力的影响[J]. 焊接学报, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
引用本文: 赵智力,刘英杰,宋来瑞. 铜柱长径比对CuCGA互连结构轴向临界压应力的影响[J]. 焊接学报, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
shu
ZHAO Zhili, LIU Yingjie, SONG Lairui. Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
Citation: ZHAO Zhili, LIU Yingjie, SONG Lairui. Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 103-106. DOI: 10.12073/j.hjxb.2018390078
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铜柱长径比对CuCGA互连结构轴向临界压应力的影响

Effect of aspect ratios of Cu column on axial critical compressive stress of CuCGA interconnection structure

摘要

    摘要
  • 摘要: 借助有限元方法研究CuCGA互连结构轴向压力载荷下的力学行为. 结果表明，直径0.32 mm、长径比5～11.5范围的铜焊柱压曲失稳前会因性能薄弱的钎焊圆角局部区域存在超过钎料极限强度的拉伸应力而引发局部微裂纹；而长径比11.5～16.5范围的铜焊柱则会首先发生屈曲失稳；在综合考虑钎焊圆角局部微裂纹失效和焊柱压曲失稳失效前提下，建立了铜柱长径比和阵列铜焊柱互连结构轴向压力载荷下临界应力的关系方程；轴向临界压应力在长径比5～11.5范围内几乎保持恒定，而在长径比11.5～16.5范围内轴向临界压应力随铜柱长径比λ0增加而降低，规律与描述大柔度杆的欧拉公式相符合.
    Abstract: The mechanical behavior of CuCGA interconnection structure under axial compression load was studied using finite element method. The results showed that tensile stress exceeded tensile strength and microcrack occurred in local area of soldering fillet before buckling instability for soldered Cu column with the diameter of 0.32 mm and aspect ratio range from 5 to 11.5. Buckling instability first occurred for Cu column with the diameter of 0.32 mm and aspect ratio range from 11.5 to 16.5. The relation equation between aspect ratio of Cu column and the critical stress of soldered Cu column interconnection under axial compressive loading was established based on comprehensive consideration of microcrack failure in soldering fillet and buckling failure. The axial critical compressive stress was nearly constant for aspect ratio of Cu column in the range of 5～11.5, while decreased with the increase of Cu column aspect ratio between 11.5～16.5. The relationship between axial critical compressive stress and aspect ratio of Cu column was consistent with the Euler formula which is used to describe large flexibility rod.
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  • [1] Park S B, Rahul Joshi. Comparison of thermo-mechanical behavior of lead-free copper and tin-lead column grid array packages[J]. Microelectronics Reliability, 2008, 48: 763-772.[2] Ghaffarian R. CCGA packages for space applications[J]. Microelectronics Reliability, 2006, 46: 2006-2024.[3] Ghaffarian R. Thermal cycle reliability and failure mechanisms of CCGA and PBGA assemblies with and without corner staking[J].IEEE Transactions on Components and Packaging Technologies, 2008, 31(2): 285-296.[4] Lau J, Dauksher W. Reliability of an 1657CCGA (ceramic column grid array) package with Sn3.9Ag0.6Cu lead-free solder paste on PCBs)[J]. Journal of Electronic Packaging, 2005, 127: 97-105.[5] 赵智力, 徐希锐, 孙凤莲, 等. 铜柱栅阵列互连结构的剪切行为[J]. 焊接学报, 2015, 36(4)： 79-82.Zhao Zhili， Xu Xirui， Sun Fenglian，et al. Shear behavior of copper column grid array interconnect structure[J]. Transactions of the China Welding Institution, 2015, 36(4)： 79-82.[6] 徐希锐. 剪切载荷下面阵列封装互连结构的力学行为研究[D]. 哈尔滨： 哈尔滨理工大学, 2015.[7] Cillian Burke, Jeff Punch. A comparision of the creep behaviour of joint scale SAC105 and SAC305 solder samples under shear conditions[C]∥13th Internationl Conference on Thermal, Mechanical and Multi-physics Simulations and Experiments in Microelectronics and Microsystems Cascais, Portugal, 2012: 16-18.[8] 肖正香, 薛松柏, 金春玉, 等. CuCGA器件焊点热疲劳行为数值模拟[J]. 焊接学报, 2009, 30(12): 77-81.Xiang Zhengxiang, Xue Songbai, Jin Chunyu,et al. Numerical simulation on thermal fatigue behavior of CuCGA soldered joints[J]. Transactions of the China Welding Institution, 2009, 30(12): 77-81.[9] 皋利利, 薛松柏, 张 亮， 等. CCGA元器件焊柱可靠性影响的有限元分析[J]. 焊接学报, 2008, 29(7): 93-96.Gao Lili, Xue Songbai, Zhang Liang,et al. Finite element analysis on influencing factors of soldered column reliability in a CCGA device[J]. Transactions of the China Welding Institution, 2008, 29(7): 93-96.[10] 陈 明, 张秋华, 严 勇, 等. 测量压杆临界压力的理论与实验[J]. 力学与实践, 2007, 29： 74-76.Chen Ming, Zhang Qiuhua, Yan Yong,et al. Theories and experiments of measuring the critical pressure for a slender compressed rod[J]. Mechanics in Engineering, 2007, 29： 74-76.
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  • 收稿日期:  2016-12-06

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