[1] |
SC Dev, CS. Sivaramakrishnan, an indigenous technology for a silver brazing alloy[J]. Mater. Des, 1996, 17(2): 75-78.[2] M M. Schwartz. Brazing[C]∥ASM International, Materials Park, 2003: 1-382.[3] 李卓然, 刘 彬, 冯吉才. 含银20%的银基无镉中温钎料配方的优化设计[J]. 焊接学报, 2008, 29(8): 5-8.Li Zhuoran, Liu Bin, Feng Jicai. Optimum design of cadmium-free silver-based filler metal contaed 20%Ag[J]. Transactions of the China Welding Institution, 2008, 29(8): 5-8.[4] 卢方焱, 薛松柏, 赖忠民, 等. 镓对 AgCuZn钎料组织和性能的影响[J]. 焊接学报, 2009, 30(1):56-59.Lu Fangyan, Xue Songbai, Lai Zhongming,et al. Effect of gallium on microstructure and properties of AgCuZn filler metal [J] Transactions of the China Welding Institution, 2009, 30(1):56-59.[5] Humpston G, Jacobson D M. Principles of soldering and brazing[J]. Journal of Scientific Instruments, 1993, 11(6): 55-59.[6] 陈小怡,李世建,何建敏. WEEE和RoHS:欧盟“双绿”指令下我国相关行业的困境与对策[J]. 国际贸易问题,2007, 289(1): 54-58.Chen Xiaoyi, Li Shijian, He Jianming. WEEE and RoHS: puzzledom and resolution for chinese related industries facing the “double green directives”of EC [J] Journal of International Trade, 2007, 289(1): 54-58.[7] Official Journal of the European Union. Directive 2002/ 96/ EC of the european parliament and of the council of 27 January 2003[R]. Waste Electrical and Electronic Equipment (WEEE), 2003, L37:24-38.[8] Official Journal of the European Union. Directive 2002/ 96/ EC of the european parliament and of the council of 27 January 2003[R]. The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, 2003, L37: 19-23.[9] 金峰日. 铜基中温无镉钎料的设计与组织性能分析[D]. 哈尔滨, 哈尔滨工业大学, 2009.[10] Wang Xiaorong, Yu Dingkong, He Yanming,et al. Effect of Sn content on brazing properties of Ag based filler alloy[J]. Material Sciences, 2013, 03(1):16-21.[11] Wang H, Xue S, Chen W,et al. Effects of Ga-Ag, Ga-Al and Al-Ag additions on the wetting characteristics of Sn-9Zn-X-Y lead-free solders[J]. Journal of Materials Science Materials in Electronics, 2009, 20(12):1239-1246.[12] Cui D, Wang Z, Wu H,et al. Preparation and property of novel-type Au-19.25Ag-12.80Ge solder alloy[J]. Rare Metal Materials & Engineering, 2008, 37(4):690-693.[13] Cao J, Zhang L X, Wang H Q,et al. Effect of Ag content on microstructure and properties of brass/steel induction brazing joint using Ag-Cu-Zn-Sn filler metal[J]. Journal of Materials Science & Technology, 2011, 27(4):377-381.[14] 赖忠民, 薛松柏, 张 亮, 等. Ag-Cu-Zn-Sn-xGa-yIn钎料性能与显微组织[J]. 焊接学报, 2010, 31(3):73-76.Lai Zhongmin, Xue Songbai, Zhang Liang,et al. Investigation on properties and microstructures of Ag2Cu-Zn-Sn-xGa-y In filler metal[J] Transactions of the China Welding Institution, 2010, 31(3): 73-76.[15] 陶 杰,姚正军,薛 烽. 材料科学基础[M]. 北京: 化学工业出版社, 2006.
|