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金刚石与无氧铜钎焊接头界面微观组织和力学性能分析

Analysis of the microstructure and mechanical properties of the interface between diamond and oxygen free copper brazing joints

  • 摘要: 采用AgCuTi钎料真空钎焊多晶金刚石与无氧铜,研究了钎焊温度(830 ℃、870 ℃、910 ℃、950 ℃)和保温时间(1、10、30、60 min)对接头界面组织和力学性能的影响,解明了接头界面形成机理,结果表明,钎焊接头的典型界面结构为金刚石/TiC/Cu(s,s)、Ag(s,s)/无氧铜,钎焊温度对钎焊接头微观结构有显著影响,当温度在910 ℃以上时,AgCuTi钎料与无氧铜基板的互溶与扩散现象明显,剪切强度随着温度的升高先提高后降低,870 ℃保温10 min的钎焊接头剪切强度最高,为223.6 MPa,最后讨论了钎焊接头的断口位置和断口形貌.

     

    Abstract: The vacuum brazing of polycrystalline diamond and oxygen free copper(OFC) using AgCuTi brazing material was conducted. The effects of brazing temperature (830 ℃, 870 ℃, 910 ℃, 950 ℃) and holding time (1、10、30、60 min) on the interface structure and mechanical properties of the joint were studied, and the mechanism of interface formation was elucidated; the typical interface structure of brazed joints is diamond/TiC/Cu (s, s), Ag (s, s)/OFC; the brazing temperature has a significant impact on the microstructure of the brazed joint. When the temperature is above 910 ℃, the mutual dissolution and diffusion phenomenon between AgCuTi brazing material and OFC substrate is obvious; the shear strength first increases and then decreases with the increase of temperature, the highest shear strength of the brazed joint is 223.7 MPa, which is maintained at 870 ℃ for 10 minutes; finally, the fracture location and morphology of the brazed joint were discussed.

     

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