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Ag-Cu-In-Ti钎焊多晶金刚石-膨胀合金接头组织与性能

Microstructure and properties of polycrystalline diamond–expansion alloy joints brazed with Ag-Cu-In-Ti filler metal

  • 摘要: 为了满足高精度光学、精密仪器及航空航天领域中光学窗口结构件的可靠连接需求,采用Ag-Cu-In-Ti低温钎料对光学窗口材料化学气相沉积(chemical vapor deposition, CVD)多晶金刚石与4J333膨胀合金进行了钎焊连接,获得了界面良好无缺陷的钎焊接头.研究了700 ℃、730 ℃和760 ℃钎焊温度对接头界面组织及力学性能的影响规律.结果表明,钎焊接头界面呈典型分层结构,由CVD多晶金刚石至4J333膨胀合金依次为金刚石母材、TiC界面反应层、中间钎缝区、合金侧扩散层与4J333基体.其中钎缝区主要分布Ag(s,s)、Cu(s,s)、Ag3In、Cu7In3、Ni3Ti、(Fe,Ni)Ti与Fe2Ti;靠近4J333侧的扩散层则包含(Fe,Co)、Cu7In3、Ag(s,s)和Cu(s,s).随着钎焊温度升高,Ni3Ti等脆性化合物数量增多、形貌粗大化且逐步向多晶金刚石侧迁移,4J333膨胀合金熔蚀区域拓宽,多晶金刚石侧TiC层厚度增加.随着钎焊温度的升高,接头的剪切强度呈现先升后降的趋势,在钎焊温度为730 ℃、保温时间为10 min的工艺条件下,接头平均剪切强度最大,为113.5 MPa.断口分析表明,接头的断裂均发生在TiC界面,均为脆性断裂.

     

    Abstract: To meet the demand for reliable joining of optical window structural components in the fields of high-precision optics, precision instruments, and aerospace, chemical vapor deposition (CVD) polycrystalline diamond was brazed to 4J333 expansion alloy using an Ag-Cu-In-Ti low-temperature filler metal, and sound brazed joints with defect-free interfaces were obtained. The effects of brazing temperatures of 700 ℃, 730 ℃, and 760 ℃ on the interfacial microstructure and mechanical properties of the joints were investigated. The results indicate that the brazed joint interface exhibits a typical layered structure. From the CVD polycrystalline diamond to the 4J333 expansion alloy, the structure successively consists of the diamond substrate, TiC interfacial reaction layer, intermediate brazing seam zone, alloy-side diffusion layer, and 4J333 substrate. The brazing seam zone is mainly composed of Ag(s,s), Cu(s,s), Ag3In, Cu7In3, Ni3Ti, (Fe,Ni)Ti, and Fe2Ti; the diffusion layer adjacent to the 4J333 side contains (Fe,Co), Cu7In3, Ag(s,s), and Cu(s,s). As the brazing temperature increases, the amount of brittle compounds such as Ni3Ti increases, their morphology coarsens, and they gradually migrate toward the polycrystalline diamond side; the dissolution zone of the 4J333 expansion alloy widens, and the thickness of the TiC layer on the polycrystalline diamond side increases. With the increase in brazing temperature, the shear strength of the joints first increases and then decreases. Under the process conditions of a brazing temperature of 730 ℃ and a holding time of 10 min, the average shear strength of the joints reaches the maximum value of 113.5 MPa. Fracture analysis indicates that the fractures of the joints all occur at the TiC interface and exhibit brittle fracture characteristics.

     

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