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不同摆动路径下铝/钛激光熔钎焊界面微观组织和断裂行为

Interface microstructure and fracture behavior of Al/Ti laser welding-brazing under different oscillation paths

  • 摘要: 为了探究激光熔钎焊过程中不同摆动路径(无摆动、8字形、三角形)对 Al/Ti异种金属接头界面微观组织、金属间化合物(Intermetallic Compound,IMC)层厚度、抗拉强度及断裂行为的影响规律. 采用激光熔钎焊技术制备Al/Ti复合接头,通过改变激光光斑的摆动路径作为关键工艺变量,利用光学显微镜、扫描电镜、能谱仪对焊缝形貌和界面组织进行表征,并结合拉伸试验分析接头的力学性能和断裂机制. 结果表明,相比无摆动,采用8字形和三角形摆动路径能有效增加钎料在Ti合金表面的铺展长度,并显著抑制界面金属间化合物的生长. 在8字形摆动下,界面IMC厚度最薄,范围为0.9 ~ 3.19 μm. EDS分析证实Si在Ti/Al界面聚集,形成了Ti(Al, Si)3 三元相. 力学性能方面,无摆动接头抗拉强度最低(119.19 MPa),断裂发生在较厚的 Ti/\ Ti(Al, Si)3界面或Ti(Al\ Si)3层,具有典型的脆性断裂特征,摆动路径通过细化IMC层,有效提高了接头强度.

     

    Abstract: Al/Ti heterogeneous metal composite components were successfully prepared using laser welding-brazing technology through three different oscillating paths (no oscillation, 8-shaped, triangular). The effects of different oscillating paths on the weld formation, intermetallic compound (IMC), tensile strength, and fracture behavior of Al/Ti joints were studied. When the oscillating path changes from no oscillation to a triangle or figure eight shape, the spreading length of the solder on the surface of the titanium alloy increases, and the thickness of the IMC layer at the interface gradually becomes thinner. Under the 8-shaped oscillation, the interface IMC is the thinnest, ranging from 0.94 to 3.19 μm. Through the analysis of the IMC layer at the interface under three oscillating paths using an energy spectrometer, it was found that Si element aggregated at the Ti/Al brazing interface, forming the Ti (Al, Si)3 ternary phase. Under the condition of no oscillation, its tensile strength is the lowest, at 119.19 MPa. The fracture occurs at the Ti/ Ti(Al,Si)3 interface or Ti(Al,Si)3 layer, and the fracture surface shows typical brittle fracture characteristics. The oscillating laser reduced the thickness of the IMC layer at the interface, improved the tensile strength of the joint, and reached 202.85 MPa. The fracture path changed from the Ti/Al brazing interface to the heat affected zone of the aluminum base material, and the fracture surface was ductile fracture.

     

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