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Cu-Sn-Ti钎料钎焊AlN和Cu接头组织和性能分析

Microstructure and properties of AlN and Cu joints brazed with Cu-Sn-Ti filler metal

  • 摘要: 采用Cu-Sn-Ti钎料实现了AlN陶瓷和Cu的钎焊连接,探究了工艺参数对AlN/Cu接头界面组织和性能的影响. 在高温真空炉中进行钎焊,依据DSC曲线确定钎料熔化温度区间,使用SEM和EDS等手段观察接头界面形貌、元素分布和物相组成. 结果表明,接头界面组织结构为AlN/TiN + TiCu/Ti2Cu + Ti2Sn + Cu(s,s)/Cu,随着钎焊温度升高或保温时间延长,钎缝区的金属间化合物层Ti2Sn相的厚度逐渐减小,而靠近AlN侧的界面反应层TiN厚度逐渐增加,分布状态由断续分布转变为连续分布. 在钎焊温900 ℃、保温时间10 min时,接头抗剪强度达到最大40.77 MPa,断裂位置由断于钎缝界面处向AlN陶瓷侧转变,最终转变为断于AlN陶瓷内部. 接头的热扩散系数随钎焊温度升高或保温时间延长呈现先增大后减小的趋势,在钎焊温度900 ℃、保温时间10 min时达到最大61.33 mm2/s.

     

    Abstract: The brazing connection between AlN ceramics and Cu was achieved by using Cu-Sn-Ti filler metal, and the effect of process parameters on the interfacial microstructure and properties of AlN/Cu joints was investigated. Brazing was conducted in a high-temperature vacuum furnace. The melting temperature range of the filler metal was determined based on the DSC curves. The interfacial morphology, element distribution, and phase composition of the joints were observed by means of SEM and EDS. The results indicate that the interfacial microstructure of the joints is AlN/TiN + TiCu/Ti2Cu + Ti2Sn + Cu(s,s)/Cu. As the brazing temperature increases, or the holding time is prolonged, the thickness of the intermetallic compound layer Ti2Sn phase in the brazing seam zone gradually decreases, while the thickness of the interfacial reaction layer TiN near the AlN side gradually increases, and its distribution state transforms from discontinuous to continuous. At a brazing temperature of 900 ℃ and a holding time of 10 min, the shear strength of the joints reaches a maximum of 40.77 MPa. The fracture location shifts from the brazing seam interface to the AlN ceramic side and finally within the AlN ceramics. The thermal diffusivity of the joints exhibits a trend of initially increasing and then decreasing with the increase of brazing temperature or the prolongation of holding time and reaches a maximum of 61.33 mm2/s at a brazing temperature of 900 ℃ and a holding time of 10 min.

     

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