Abstract: Selective wave soldering provides high-quality and high-efficiency results, relying on the point-to-point welding method and the flexibility of the process parameters. However, a mature solution has yet to be formulated in either domestic or international research to address the technical challenges associated with optimizing its process parameters for specific working conditions. This paper proposes a systematic dynamic numerical simulation method for the selective wave soldering process to analyze its soldering mechanism and provides an efficient method for process parameter optimization. The method is based on overset grid technology for dynamic domain meshing and uses the Continuum surface force model and the Volume of fluid method for the surface tension calculation and interface tracking of molten solder. The results indicate that the preheating temperature of the components has a limited influence on the solder filling process, while excessively fast solder spray or insufficient component height may lead to bridging in the component gaps. Additionally, the chain speed affects the formation of conical soldering points.