Abstract: Selective wave soldering can achieve high-quality and high-efficiency welding tasks tailored to different working condition requirements, relying on the point-to-point welding method and the flexibility of the process parameters. However, a mature solution has yet to be formulated in either Chinese or international research to address the technical challenges associated with optimizing its process parameters for specific working conditions. A systematic dynamic numerical simulation method for the selective wave soldering process was proposed to analyze its soldering mechanism and provide an efficient method for process parameter optimization and theoretical guidance for engineering practice. The method was based on overset grid technology for dynamic domain meshing and used the continuum surface force model and the volume of fluid method for the surface tension calculation and interface tracking of molten solder. The results indicate that the preheating temperature of the components has a limited influence on the solder filling process, while excessively fast solder spray or insufficient component height may lead to bridging defects in the component gaps. Additionally, the wire feed speed affects the formation of conical soldering points.