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Si3N4/Cu AMB接头组织与性能分析

Microstructure and mechanical properties of Si3N4/Cu AMB joints

  • 摘要: 采用Ag-Cu-In-Ti钎料在钎焊温度为780 ℃的条件下实现了Si3N4和Cu的活性钎焊连接,研究了接头界面组织及其形成机制,分析了保温时间对接头界面组织和力学性能的影响.结果表明,钎焊过程中,Ti元素与Si3N4反应形成了厚度约为170 nm的纳米多晶TiN反应层与波浪状轮廓的Ti5Si3反应层.钎缝中,反应后剩余的Ti原子与钎料中的Cu,In原子生成Cu2InTi,Cu4Ti两种脆性化合物,此外,还出现了极少量Cu3Ti2相和CuTi相.保温时间通过控制陶瓷侧界面反应进程来调控Ti5Si3反应产物形貌,以及钎缝中脆性Cu2InTi和Cu4Ti化合物的含量,两者共同决定钎焊接头的抗剪强度.随着保温时间的延长,界面反应更为充分,钎缝中的脆性金属间化合物含量减少.当保温时间为20 min时,接头平均抗剪强度最大为309 MPa,其断裂发生在靠近Si3N4陶瓷的界面双反应层处,其中Ti5Si3更为薄弱.

     

    Abstract: The active metal brazed joints of Si3N4 and Cu were obtained by using Ag-Cu-In-Ti brazing filler at a brazing temperature of 780 °C. The interfacial microstructure of the joint and its formation mechanism were investigated, and the effect of holding time on the interfacial microstructure and mechanical properties of the joint was analyzed. The results have shown that during brazing, the Ti element reacts with Si3N4 to form a 170 nm-thick nanocrystalline TiN and a Ti5Si3 layer with a wavy profile. In the brazing seam, the residual Ti atoms after the reaction integrate with two brittle compounds, Cu2InTi and Cu4Ti. In addition, a very small amount of Cu3Ti2 and CuTi phases occurs. By regulating the reaction process at the Si3N4 ceramic-side interface, the holding time controls the morphology of the Ti5Si3 reaction products, as well as the content of brittle Cu2InTi and Cu4Ti compounds in the brazing seam, which determines the shear strength of the brazing joints. With the extension of the holding time, the interfacial reaction becomes more sufficient, and the amount of brittle intermetallic compounds in the brazing seam decreases. When the holding time is 20 min, the shear strength of the joints reaches the highest, with a value of 309 MPa. The fracture occurs at the interfacial reaction bilayer close to the Si3N4 ceramic, among which the Ti5Si3 is weaker.

     

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