Abstract: In response to the need for high-quality bonding of NiV alloy targets, the vacuum hot press diffusion bonding of NiV alloy and oxygen-free copper without intermediate layer was investigated at different temperatures under fixed pressure and time conditions. Laser confocal microscope, microhardness tester, scanning electron microscope(SEM), X-ray diffractometer, (XRD)and electron backscattering diffraction(EBSD)were used to characterize the changes in the organizational structure, interfacial element distribution and mechanical properties before and after the vacuum hot pressing bonding. The results show that vacuum hot pressing can realize the direct diffusion connection between NiV alloy and Cu, and with the increase of bonding temperature, the mutual diffusion of elements occurs at the interface, and the shear strength and weld bonding rate are improved, reaching 109.59 MPa shear strength and 100% weld bonding rate at 650 ℃. The analysis of metallographic, sputtering surface XRD and EBSD tests on NiV alloys shows that, in the period of 650 ℃, the shear strength and the weld bonding rate increase to 109.59 MPa and 100% weld bonding rate, respectively. The analysis of metallographic XRD and EBSD test of NiV alloy shows that the diffusion bonding at T = 650 ℃ bonding parameter has very little effect on the grain size uniformity and crystal structure of NiV alloy, and it does not affect the sputtering requirement of NiV alloy target material.