Quality control and reliability of PQFP device solder joints
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摘要:
针对航空航天领域PQFP（plastic quad flat package）封装器件长期贮存可靠性问题，文中围绕焊点工艺参数优化及界面金属间化合物(interfacial intermetallic compounds，IMCs)演变规律展开系统性研究.通过光镜检测、力学性能测试与扫描电镜分析，揭示了焊缝高度与钎料量对焊点质量的影响机制.结果表明，钎料量增加使润湿高度提升(0.05
0 ~ 0.099 3 mm3为理论最佳范围)，而焊缝高度增大则削弱润湿效果，0.12 mm钢网与0.05 mm焊缝高度组合可实现桥联率最低、抗拉强度最优的焊接质量.通过高温加速老化试验发现，Cu焊盘侧IMC由Cu6Sn5/Cu3Sn构成且呈扇贝状向平直状演变，Ni阻挡层使引脚侧(Cu，Ni)6Sn5层厚度降低.基于Fick扩散定律建立的IMC生长动力学模型表明，双侧IMC层厚符合抛物线生长规律，活化能分别为20.67 kJ/mol(Cu侧)和52.79 kJ/mol(Ni侧).以IMC临界厚度3.5 μm为失效判据，推算出器件焊点在23 ℃贮存寿命可达27.5年，研究成果为航天电子装备的长寿命可靠性设计与工艺优化提供了理论依据和数据支撑.Abstract:In view of the long-term storage reliability issues of PQFP devices in aerospace applications, the optimization of solder joint process parameters and the evolution mechanism of IMCs were systematically investigated. Through optical microscopy, mechanical property testing, and scanning electron microscopy analysis, the influence mechanisms of weld height and soldering alloy volume on solder joint quality were revealed. The results show that increasing soldering alloy volume enhances wetting height (the theoretical optimal range is 0.05 ~ 0.099 3 mm3), while greater weld height diminishes wetting effects. The combination of a 0.12 mm steel mesh and 0.05 mm weld height achieves the lowest bridging rate and optimal tensile strength. High-temperature accelerated aging experiments demonstrate that Cu6Sn5/Cu3Sn IMCs on the Cu bonding pad side evolve from a scalloped to planar morphology, while the Ni barrier layer reduces the thickness of (Cu,Ni)6Sn5 IMCs on the lead side. A kinetics model for IMC growth, based on Fick’s diffusion law, indicates parabolic growth behavior for bilateral IMC layers, with activation energies of 20.67 kJ/mol (Cu side) and 52.79 kJ/mol (Ni side). By using a critical IMC thickness of 3.5 μm as the failure criterion, the estimated storage life of solder joints at 23 ℃ reaches 27.5 years. This research provides theoretical foundations and data support for the long-term reliability design and process optimization of aerospace electronic systems.
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图 2 不同工艺参数下引脚金相剖面
Figure 2. Metallographic section of lead under different process parameters. (a) 0.09 ~ 0.02; (b) 0.09 ~ 0.05; (c) 0.09 ~ 0.10; (d) 0.12 ~ 0.02; (e) 0.12 ~ 0.05; (f) 0.12 ~ 0.10; (g) 0.15 ~ 0.02; (h) 0.15 ~ 0.05; (i) 0.15 ~ 0.10
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图 3 焊接后器件引脚俯视图
Figure 3. Top view of device lead after soldering. (a) 0.15 ~ 0.02; (b) 0.15 ~ 0.05; (c) 0.12 ~ 0.02
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图 4 最大拉力与钎料量和焊缝高度关系
Figure 4. Relationship between maximum tensile force, solder volume, and stand-off height
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图 5 150 ℃不同老化时间下焊点微观组织形貌(0.02 mm焊缝高度)
Figure 5. Microstructure morphology of solder joints at different aging times at 150 ℃ (0.02 mm stand-off height). (a) overall morphology after 4 days of thermal aging; (b) enlarged image of zone A; (c)enlarged image of zone B; (d) overall morphology after 9 days of thermal aging; (e) enlarged image of zone A; (f) enlarged image of zone B; (g) overall morphology after 16 days of thermal aging; (h) enlarged image of zone A; (i)enlarged image of zone B; (j) overall morphology after 16 days of thermal aging; (k) enlarged image of zone A; (l) enlarged image of zone B
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图 6 150 ℃老化25天焊点微观组织形貌
Figure 6. Microstructure morphology of solder joints after 25 days of aging at 150 ℃. (a) overall morphology of solder joints (0.05 mm stand-off height); (b) enlarged image of zone A; (c) overall morphology of solder joints (0.10 mm stand-off height); (d) enlarged image of zone B
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图 7 桥联发生率与钎料量的关系
Figure 7. Relationship between solder bridging rate and solder volume
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图 8 必要焊料量计算示意图
Figure 8. Schematic diagram of necessary solder volume calculation. (a) left view; (b) main view
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图 9 焊料根部吸收示意图
Figure 9. Schematic diagram of solder root absorption. (a) left view; (b) main view
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图 10 不同老化温度及老化时间下Cu焊盘/钎料界面微观组织
Figure 10. Microstructure of Cu pad/solder interface under different aging temperatures and aging times
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图 11 不同老化温度及老化时间下Cu引脚/钎料界面微观组织
Figure 11. Microstructure of Cu lead/solder interface under different aging temperatures and aging times
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图 12 焊点两侧不同温度下界面处IMC厚度随时间变化关系
Figure 12. Relationship between the thickness of IMC at the interface at different temperatures on both sides of the solder joint and time (a) on the Cu pad side; (b) Cu lead side
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图 13 焊点两侧IMC生长的Arrhenius图
Figure 13. Arrhenius diagram of IMC growth on both sides of the solder joint. (a) Cu pad side; (b) Cu lead side
表 1 PQFP引脚尺寸
Table 1 PQFP lead size
名称 规格 d/mm 名称 规格 d/mm 引脚布局 11 × 4(个) 引脚宽度B 0.315 引脚厚度σ 0.145 引脚间距P 0.65 
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表 2 工艺参数设计
Table 2 Process parameter design
工艺编号 钢网厚度Th/mm 焊缝高度H/mm 0.09～0.02 0.09 0.02 0.09～0.05 0.09 0.05 0.09～0.10 0.09 0.10 0.12～0.02 0.12 0.02 0.12～0.05 0.12 0.05 0.12～0.10 0.12 0.10 0.15～0.02 0.15 0.02 0.15～0.05 0.15 0.05 0.15～0.10 0.15 0.10
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