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金刚石与无氧铜钎焊接头界面微观组织和力学性能分析

Microstructure and mechanical properties of interface between diamond and oxygen-free copper brazed joints

  • 摘要: 采用AgCuTi钎料真空钎焊多晶金刚石与无氧铜,研究了钎焊温度(830、870、910、950 ℃)和保温时间(1、10、30、60 min)对接头界面组织和力学性能的影响,解明了接头界面形成机理. 结果表明,钎焊接头的典型界面结构为金刚石/TiC/Cu(s,s)、Ag(s,s)/无氧铜,钎焊温度对钎焊接头微观结构有显著影响,当温度在910 ℃以上时,AgCuTi钎料与无氧铜基板的互溶与扩散现象明显,剪切强度随着温度的升高先提高后降低,870 ℃保温10 min的钎焊接头剪切强度最高,为223.6 MPa,最后讨论了钎焊接头的断口位置和断口形貌.

     

    Abstract: The vacuum brazing of polycrystalline diamond and OFC using AgCuTi brazing material was conducted. The effects of brazing temperature (830、 870、 910、950 °C) and holding time (1, 10, 30、60 min) on the interface structure and mechanical properties of the joint were studied, and the mechanism of interface formation was elucidated. The results show that the typical interface structure of brazed joints is diamond/TiC/Cu (s, s), Ag (s, s)/OFC; the brazing temperature has a significant impact on the microstructure of the brazed joint. When the temperature is above 910 °C, the mutual dissolution and diffusion phenomenon between AgCuTi brazing material and OFC substrate is obvious. The shear strength first increases and then decreases with the increase in temperature, and the highest shear strength of the brazed joint maintained at 870 °C for 10 minutes is 223.6 MPa. Finally, the fracture location and morphology of the brazed joint were discussed.

     

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