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AlCoCrNiCuAg高熵合金粉末中间层真空扩散连接TC4钛合金/316L不锈钢

Title: Vacuum diffusion bonding of TC4 titanium alloy to 316L stainless steel with AlCoCrNiCuAg high-entropy alloy interlayer

  • 摘要: 钛/钢扩散焊复合构件在航空航天高端制造领域有着广阔的应用前景,然而界面脆性金属间化合物是导致其接头性能劣化的主要原因,文中创新设计了具有液相分离特征的AlCoCrNiCuAg高熵合金粉末中间层,通过形成部分液相降低了依靠单一塑性变形对连接界面组织性能产生的不良影响.研究了在不同焊接温度作用下AlCoCrNiCuAg高熵合金中间层对TC4钛合金和316L不锈钢真空扩散接头界面组织和力学性能的影响规律.接头典型界面结构为α-Ti + β-Ti/β-Ti/β-Ti + Ti(Fe,Ni) + Ti2Ni/Ti(Fe,Ni)/TiFe2 + Fe2Cr5Ti17/ Fe2Cr5Ti17 + λ-(Fe,Cr)2Ti + α-Fe/γ-Fe.随着焊接温度的升高,与TiFe2反应层相邻的Ti(Fe,Ni)、α-Fe等反应层厚度逐渐增加,同时接头孔洞等缺陷大幅减少,扩散焊接头抗剪强度在二者协同作用下逐渐升高,在1 010 ℃ /30 min时达到最大181 MPa.高熵合金中间层抑制了接头中TiFe2等脆性金属间化合物的产生,促进了韧性(Fe, Ni)固溶相的形成,实现了钛/钢的可靠连接.

     

    Abstract: Titanium alloy/steel diffusion bonded composite components had a broad application prospect in advanced aerospace manufacturing. Still, the brittle intermetallic compounds (IMCs) were the main reason for the deterioration of the joints. AlCoCrNiCuAg high-entropy powder interlayer with liquid phase separation was innovatively designed. By forming parts of the liquid phase, the deficiency of single plastic deformation on the microstructure and mechanical properties in the interface was reduced. The effect of bonding temperatures on the interfacial microstructure and mechanical properties was investigated. The typical interfacial microstructure of α-Ti + β-Ti/β-Ti/β-Ti + Ti(Fe,Ni) + Ti2Ni/Ti(Fe,Ni)/TiFe2 + χ-Fe2Cr5Ti17/ χ-Fe2Cr5Ti17 + λ-(Fe,Cr)2Ti + α-Fe/γ-Fe was formed. With the bonding temperatures increased, the thickness of Ti(Fe, Ni) and α-Fe adjacent to the TiFe2 reaction layer increased, and the defects at the interface (pores) during the bonding were reduced. The shear strength indicated an increasing trend under the synergistic action, and the highest shear strength reached 181 MPa at 1010 ℃ for 30 min. The high entropy powder interlayer inhibited the generation of TiFe2 IMCs and promoted the formation of the (Fe, Ni) solid solution phase, achieving a sound bonding. Meanwhile, the defects such as pores were significantly reduced.

     

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