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采用AlSiMgCu钎料液相辅助扩散连接6063铝合金接头组织与力学性能分析

Liquid-phase assisted diffusion bonding of 6063 Al-alloy with AlSiMgCu brazing material

  • 摘要: 多层微通道铝合金散热结构凭借高效的散热能力被广泛应用于电力电子领域,而实现其高质量连接是工程应用的前提. 文中采用AlSiMgCu对6063铝合金进行了液相辅助扩散连接,探究了连接压力、保温时间和温度对接头界面组织和力学性能的影响. 结果表明,该方法通过施加最小0.5 MPa压力挤出液态钎料的途径,不但消除了钎焊接头的组织不均匀性,而且降低了扩散连接对母材表面质量和工艺参数的严格要求,具有尺寸精度高、工艺参数适应性强的优点. 在0.5 ~ 2 MPa压力、530℃ ~ 550 ℃温度、1 ~ 4 h时间参数范围内接头界面组织相似,其典型界面组织为铝合金基体及少量填充与表面粗糙度同等尺度微观间隙的液态钎料凝固组织,且抗拉强度几乎不变,在550 ℃/1 h/2 MPa参数下接头与母材等强,抗拉强度为107 MPa,变形率仅为0.10%.

     

    Abstract: Multilayer microchannel aluminum alloy thermal structures are commonly used in power electronics owing to their efficient heat dissipation capabilities. Achieving high-quality bonding is essential for engineering applications. This paper investigates the effects of bonding pressure, holding time, and temperature on the interface microstructure and mechanical properties of the joint created by liquid-phase assisted diffusion bonding of 6063 Al using AlSiMgCu brazing material. The method eliminates the organizational inhomogeneity of brazed joints by extruding liquid filler metal with smaller pressure. It also reduces the stringent requirements of diffusion joining on the surface quality of base material and process parameters. Additionally, it offers high dimensional accuracy and adaptability of process parameters. The microstructure of joints remains consistent across a broad range of parameters. It typically consists of an Al alloy matrix and a small amount of solidified liquid brazing material, which fills micro gaps of the same scale as the surface roughness. The tensile strength of joints remains almost unchanged, which is equal to base material under the parameter of 550 ℃/1 h/2 MPa, with a tensile strength of 107 MPa and a deformation rate of only 0.10%.

     

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