Reliability optimization of solder joints in large-sized COTS devices based on solder mask layer design
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摘要:
高可靠应用领域常常需要专用器件，其迭代更新较慢且成本较高，商用现货(commercial off-the-shelf ，COTS)器件更新速度快且质量一致性较好，然而在专用领域的适用性和可靠性尚未得到验证，为此，提出了一种基于阻焊层设计的大尺寸COTS器件焊点可靠性方法.首先，通过焊点形态仿真获得了不同阻焊层参数下的焊点形态，然后对不同参数下的器件进行板级热循环仿真.结果表明，阻焊层设计会影响焊点形态，从而影响在热循环过程中的应力—应变状态，通过计算焊点预期寿命得到优化参数，优化后的焊点预测寿命提高了118%，证明了从封装设计角度提高COTS器件焊点可靠性的可行性，推动了COTS器件在高可靠性领域的应用进程.
Abstract:High reliability application fields often require specialized devices, which have slower iteration updates and higher costs. COTS devices have a fast update speed and good quality consistency, but their applicability and reliability in specialized fields have not been fully verified. Therefore, a reliability method for large-size COTS device solder joints based on solder mask layer design is proposed. Firstly, solder joint morphology simulation is used to obtain solder joint morphology under different solder mask layer parameters; Furthermore, plate level thermal cycling simulations were conducted on devices with different parameters. The results showed that the design of the solder mask layer would affect the shape of the solder joints, thereby affecting their stress-strain state during the thermal cycling process. The optimized parameters were obtained by calculating the expected lifespan of the solder joints, and the predicted lifespan of the optimized solder joints was increased by 118%. This proved the feasibility of improving the reliability of COTS device solder joints from the perspective of packaging design, and promoted the application process of COTS devices in the field of high reliability.
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图 1 COTS器件示意图(mm)
Figure 1. Schematic of COTS device. (a) size of device; (b) cross-sectional morphology
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图 3 阻焊层对焊点形态的影响
Figure 3. Effect of solder mask layer on solder joint shapes. (a) effect; (b) no effect
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图 5 不同阻焊层参数下的焊点形态(mm)
Figure 5. Solder joint shapes under different parameters of solder mask layer
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图 6 热循环过程中的温度分布
Figure 6. Temperature distribution of solder joints with thermal cycling. (a) PCB; (b) solder joint
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图 10 500个温度循环后的焊点SEM
Figure 10. SEM of solder joints after 500 thermal cycles. (a) without the influence of solder mask; (b) with the influence of solder mask
表 1 焊点形态仿真中的阻焊层参数
Table 1 Parameters of solder mask layer in solder joint shape simulation
参数 取值1 取值2 取值3 取值4 取值5 取值6 阻焊层与下焊盘间距d/μm 50 60 70 80 90 100 阻焊层厚度h/μm 20 28 41 54 67 80 
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表 2 影响焊点形态的阻焊层参数组合
Table 2 Parameters of solder mask layer affecting solder joint shapes
参数序号 阻焊层厚度
h/mm阻焊层与下焊盘间距
d/mm1 20 0.07 2 54 0.05 3 67 0.05 4 80 0.05 5 67 0.06 6 80 0.06 7 67 0.07 8 80 0.07 9 80 0.08
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表 3 焊接工艺参数
Table 3 Welding experiment paraments
参数序号 塑性应变ε 热循环寿命Nf 1 0.011 584 9 2 342 2 0.011 618 0 2 326 3 0.012 935 8 1 792 4 0.014 569 5 1 342 5 0.011 624 8 2 323 6 0.015 993 9 1 070 7 0.012 744 7 1 858 8 0.012 442 6 1 969 9 0.013 557 2 1 599
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