Abstract: The joining technology of brittle transparent materials has been widely applied in aerospace, electronic packaging, and sensor industries. Research on the bonding of brittle transparent materials holds significant academic and engineering value. As an emerging joining method, laser micro-joining offers advantages over traditional welding techniques, including high precision, superior strength, enhanced reliability, and improved efficiency. This paper comprehensively reviews the research progress and industrial applications of continuous-wave and pulsed laser joining technologies for brittle transparent materials. The mechanisms of different types of laser bonding for brittle and hard transparent materials are analyzed, with emphasis on the influence of process parameters on joint microstructure and mechanical properties. Finally, challenges in current laser joining of brittle materials are discussed. Perspectives on future development directions are provided based on the authors' insights.