Abstract: The joining technology of brittle and transparent materials has been widely applied in aerospace, electronic packaging, and sensor industries. Research on the joining technology of transparent materials holds significant academic and engineering application value. As an emerging joining method, laser micro-joining offers advantages over traditional welding methods, including high precision, superior strength, enhanced reliability, and improved efficiency. This paper comprehensively reviewed the research progress and applications of continuous-wave and pulsed laser joining technologies for brittle and transparent materials. The mechanisms of different types of laser joining for brittle and transparent materials were analyzed, and the influence of process parameters on joint microstructure and mechanical properties was summarized. Finally, challenges in the current of laser joining of brittle and transparent materials were discussed. Moreover, future development directions for laser joining of brittle and transparent materials were provided based on the authors’ insights.