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采用激光预置铜层钛钢接头成形与组织

Laser-induced pre-placed copper layer titanium-steel joint forming and microstructure research

  • 摘要: 钛钢复合板在爆炸成形过程中会产生局部未熔合等缺陷,目前采用电弧焊修复时精度、质量与自动化程度相对较低,主要难点集中在钢表面铜过渡层的高质量制备方面. 为此提出采用半导体激光同轴送粉的方法精确成形铜过渡层,并在铜层表面TIG熔覆钛层实现复合板的局部修复,采用半导体激光熔覆试验系统,分析了激光功率、送粉速率、扫描速度对铜层熔覆成形参数及微观组织的影响,并在铜层表面继续TIG熔覆钛层,工艺优化后得到了成形良好的Ti-Cu-Fe接头并对接头进行了微观组织测试与性能评价. 结果表明,采用半导体激光可以实现铜层熔覆厚度的精确控制,厚度范围为0.236 ~ 0.462 mm;从Cu-Fe接头能谱仪(energy dispersive spectrometer,EDS)可以发现,通过铜层厚度的控制,上表面区域的Fe元素含量明显减小,有利于减少脆硬的Fe-Ti金属间化合物生成;TIG堆焊钛层后,接头主要以CuTi2金属间化合物为主, 接头平均抗剪强度为194 MPa,接头断裂方式为脆性断裂.

     

    Abstract: During the explosive forming of titanium-steel composite plates, defects such as incomplete fusion may occur. Currently, the accuracy, quality, and level of automation in using arc welding for repair are relatively low. The main difficulty lies in the high-quality preparation of the copper transition layer on the steel surface. In this study, a method that utilizes semiconductor laser coaxial powder feeding was proposed to accurately form the Cu transition layer, followed by TIG cladding of a Ti layer on the surface of the Cu layer to achieve localized repair of the composite plate. Using the established semiconductor laser cladding experimental system, the influences of laser power, powder feeding speed, and scanning speed on the cladding parameters and microstructure of the Cu layer were analyzed. After TIG cladding of the Ti layer on the Cu layer surface, a well-formed Ti-Cu-Fe joint was obtained through process optimization, and its microstructure was tested and performance evaluation. The results indicate that :The use of semiconductor lasers enables precise control of the copper cladding thickness, achieving a thickness range of 0.236 ~ 0.462 mm; Energy dispersive spectrometer (EDS) analysis of the Cu-Fe joint reveals that controlling the copper layer thickness significantly reduces Fe content in the upper surface region, thereby suppressing the formation of brittle Fe-Ti intermetallic compounds;After TIG surfacing of the titanium layer, the joint primarily consists of CuTi₂ intermetallic compounds, exhibiting an average shear strength of 194 MPa with a brittle fracture mode.

     

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