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电流作用下Cu/Sn-15Bi/Cu焊点的组织演变

郭沁涵,赵振江,沈春龙

郭沁涵,赵振江,沈春龙. 电流作用下Cu/Sn-15Bi/Cu焊点的组织演变[J]. 焊接学报, 2017, 38(10): 103-106. DOI: 10.12073/j.hjxb.20170730003
引用本文: 郭沁涵,赵振江,沈春龙. 电流作用下Cu/Sn-15Bi/Cu焊点的组织演变[J]. 焊接学报, 2017, 38(10): 103-106. DOI: 10.12073/j.hjxb.20170730003

电流作用下Cu/Sn-15Bi/Cu焊点的组织演变

  • 摘要: 对Cu/Sn-15Bi/Cu焊点在150℃下的电迁移组织演变进行了研究. 结果表明,焊点阳极侧出现了近共晶相的偏聚,近共晶相厚度随电迁移时间的延长而逐渐增加;受“电子风”力的影响,钎料中Cu6Sn5金属间化合物逐渐向阳极侧偏聚,此外,由于阴极侧Cu6Sn5界面金属间化合物的脱落,钎料中的Cu6Sn5金属间化合物体积分数逐渐增加;焊点阴极侧界面金属间化合物厚度随电迁移时间延长逐渐增加,阳极侧界面金属间化合物厚度随电迁移时间延长先增加,后降低,当电迁移时间超过5 h后,界面金属间化合物厚度迅速增加.
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  • 期刊类型引用(1)

    1. 邹阳,郭波,段学俊,吴庆堂,魏巍,吴焕. 无铅焊点可靠性的研究进展. 焊接. 2021(08): 41-48+64 . 百度学术

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  • 收稿日期:  2017-07-29

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