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摘要: 纳米铜基导电薄膜具有高导电、高性价比且易与柔性基材结合等优点,在下一代柔性电子产品领域具有广泛的应用前景. 然而,纳米铜基导电薄膜在制备的过程中易被氧化,成为制备高导电纳米铜基导电薄膜的难题. 文中从油墨配方、印刷方法、烧结方法等方面系统的介绍了纳米铜基柔性导电薄膜的制造方法,着重介绍了目前抗氧化油墨的设计思路,阐明了目前柔性电子先进微纳连接技术的工艺流程,对比了其优缺点及适用范围,并列举了纳米铜基导电薄膜在下一代柔性电子产品领域的典型应用. 在此基础上,对纳米铜柔性导电薄膜制造尚存的主要问题进行了总结,并对其未来发展趋势进行了展望.
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图 3 热烧结工艺示意图(RT表示室温,LT表示低温,HT表示高温)[56]
Figure 3. Schematic diagram of the thermal sintering process (RT indicates room temperature, LT indicates low temperature, and HT indicates high temperature)
表 1 不同前驱体纳米铜基导电油墨工艺、方法和稳定性
Table 1 Processes, methods and stability of copper nanobased conductive inks with different precursors
前驱体 基板 印刷—烧结方法 方阻/电阻率 温度—时间 参考文献 铜@银纳米颗粒 玻璃 丝网印刷—热烧结 113 mΩ·sq−1 室温—三周 [31] 铜@银纳米颗粒 玻璃 旋转丝网印刷—热烧结 0.60 Ω·sq−1 室温-两个月 [32] 铜@银纳米颗粒 聚酰亚胺(PI) 喷墨打印—热烧结 3.21 μΩ·cm 156 ℃-40 d [28] 铜@银纳米颗粒 玻璃 喷墨打印—热烧结 11 μΩ·cm NA [33] 铜@银纳米颗粒 玻璃 平面丝网印刷—热烧结 0.18 Ω·sq−1 室温-六个月 [34] 铜@银纳米颗粒 PI 旋转丝网印刷—激光烧结 28.5 μΩ·cm NA [35] 铜@银纳米颗粒 玻璃 旋转丝网印刷—热烧结 13.7 μΩ·cm NA [36] 铜@银纳米线 聚氨基甲酸酯(PU) 喷墨打印—热烧结 35 Ω·sq−1 140 ℃-500 h [37] 铜@金纳米线 玻璃 NA—热烧结 35 Ω·sq−1 80 ℃-700 h [38] 氧化铜纳米颗粒 PI NA—激光烧结 31 μΩ·cm NA [30] 氧化铜纳米颗粒 玻璃 旋转丝网印刷—激光烧结 9.5 μΩ·cm NA [39] 氧化铜纳米颗粒 聚乙烯(PE) 喷墨打印—强脉冲光烧结 3.1 μΩ·cm NA [40] 氧化铜纳米颗粒 聚对苯二甲酸乙二醇酯(PET) 喷墨打印—强脉冲光烧结 9 μΩ·cm NA [41] -
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