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刘骏, 周广涛, 陈聪彬, 牛济泰. SiCp/Al激光诱导钎焊接头界面行为及性能[J]. 焊接学报, 2015, 36(8): 43-46.
引用本文: 刘骏, 周广涛, 陈聪彬, 牛济泰. SiCp/Al激光诱导钎焊接头界面行为及性能[J]. 焊接学报, 2015, 36(8): 43-46.
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LIU Jun, ZHOU Guangtao, CHEN Congbin, NIU Jitai. Interface behavior and performance of laser induced brazing for SiCp/Al composite[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 43-46.
Citation: LIU Jun, ZHOU Guangtao, CHEN Congbin, NIU Jitai. Interface behavior and performance of laser induced brazing for SiCp/Al composite[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 43-46.
shu

SiCp/Al激光诱导钎焊接头界面行为及性能

Interface behavior and performance of laser induced brazing for SiCp/Al composite

    摘要
  • 摘要: 针对T/R模块壳体结构封装的特殊性,提出了激光诱导钎焊方法并建立其机理模型.以增强相体积分数为55%的SiCP/Al复合材料为母材,根据激光诱导温度场的特殊性,采用AlZn25Si1,ZnAl7,纳米铝粉,微颗粒锡4种钎料对铝基复合材料进行了氩保护气氛钎焊试验,利用扫描电镜和EDS能谱分析的方法对钎焊接头的界面结合和断口形貌进行了研究.在保证接头材料表面不受热损伤、且搭接界面钎料熔化的特殊温度场的条件下,确定了激光的参数.结果表明,低熔点的ZnAl7、纳米铝粉钎料容易得到良好的接头,界面层通过扩散实现了冶金结合,断口分析表明,钎焊接头的断口位于钎缝偏于母材内一侧,具有一定的连接强度.

     

    Abstract: Laser induced brazing was proposed in terms of the particularity of T/R module packaging structure. SiCp/Al composites containing 55% SiCp was chosen as base metals. According to the particularity of temperature field induced by laser, brazing test was conducted under Ar atmosphere, using four kinds of solder, including AlZn25Si1, ZnAl7, nanometer Al powder and micro particles of Sn. The interfacial microstructures and fracture surfaces were investigated by SEM and EDS. Laser parameters were determined to ensure the composites surface being free from thermal damage and molten solder interface. The results show that low melting solder ZnAl7 and nanometer Al powder were easy to obtain a better brazing joint, which can realize metallurgical bonding by diffusion. The fracture analysis indicates that the fracture lies on the base material side and has certain strength.

     

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