热切缺陷对陶瓷封装钎焊组装工艺可靠性的影响——I.热切缺陷评估
Effect of hot-cutting defect on reliability of brazing process in ceramic package manufacturing(Ⅰ)
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摘要: 陶瓷封装制造钎焊工艺可靠性与裸露在陶瓷表面的热切缺陷有关,针对裸露在陶瓷侧面和棱边附近的热切缺陷进行研究和评估.通过3-D光学显微镜和扫描电子显微镜(SEM)分别对生瓷状态和烧结之后的热切表面进行观察,确定热切缺陷的形态特征.依据Griffth断裂准则,通过三点弯曲强度试验对缺陷的损伤进行评估.多重比较检验方法用来分析不同表面状态下的强度统计.观察结果表明,热切缺陷是一种形态明显不同的新型缺陷,同时不同表面的多重比较也表明,相对于陶瓷的本征缺陷,热切缺陷对结构的损伤更大,从而会显著降低组装结构的可靠度.Abstract: Reliability of the brazing process in ceramic package manufacturing is affected by the hot-cutting defect on ceramic surface. This paper characterizes and estimates the rarely mentioned defects formed during hot-cutting process of alumina green tape. Surface and edge morphology of hot-cutting surface is examined by 3-D optical microscope and scanning electron microscope(SEM) before and after sintering. Based on Griffth fracture criteria, three-point flexural test is utilized to estimate the fracture dominated by defects on different surfaces. Multiple comparison is conducted to test the difference between fracture statistics governed by defects on different surfaces. Observation shows the hot-cutting defect is new defect existing on the cutting surface with completely different morphology, and results of multiple comparison indicate the edge hot-cutting defect is more dangerous than the intrinsic defect in ceramic and is prone to degrade the reliability a lot in the assembling process.
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