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何鹏, 矫震, 王君, 林铁松. 纳米尺度连接技术的研究现状与展望[J]. 焊接学报, 2013, (2): 109-112.
引用本文: 何鹏, 矫震, 王君, 林铁松. 纳米尺度连接技术的研究现状与展望[J]. 焊接学报, 2013, (2): 109-112.
HE Peng, JIAO Zhen, WANG Jun, LIN Tiesong. Research and application of joining technology at nanometer scale[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (2): 109-112.
Citation: HE Peng, JIAO Zhen, WANG Jun, LIN Tiesong. Research and application of joining technology at nanometer scale[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (2): 109-112.

纳米尺度连接技术的研究现状与展望

Research and application of joining technology at nanometer scale

  • 摘要: 纳米材料以其特有的结构和性质而得到了广泛应用,纳米尺度的连接技术也随之逐渐发展起来,在电子、宇航、生物医疗等领域具有广阔的应用前景.介绍了纳米材料的微观效应,并综述了纳米尺度连接技术的研究进展,其中主要介绍了纳米固相连接、纳米钎焊和纳米熔化焊的研究现状,分析了在纳米尺度进行材料连接时,一些现象和物理过程与宏观连接时的区别,同时指出了分子动力学方法在纳米连接领域的作用,最后对纳米尺度连接技术的应用前景进行了展望.

     

    Abstract: Nanomaterials have been widely applied due to their unique properties. Joining technology at nanometer scale is gradually developed with the popularity of nanomaterials,which has broad application prospects in the fields of electronics,aerospace, biology,and health care. The microscopic effects of nanomaterials were introduced and the current development of joining technology at nanometer scale were reviewed. Solid state bonding,soldering/brazing and fusion welding were mainly discussed. The differences in some phenomena and physical processes between nanoscale and macroscale were analyzed. In addition, the function of molecular dynamics simulation in nano-joining field was pointed out. At last,the application prospect of joining technology at nanometer scale was presented.

     

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