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邹家生, 曾鹏, 许祥平. 非晶钎料加铜层连接Si3N4陶瓷的高温强度[J]. 焊接学报, 2012, (11): 47-50.
引用本文: 邹家生, 曾鹏, 许祥平. 非晶钎料加铜层连接Si3N4陶瓷的高温强度[J]. 焊接学报, 2012, (11): 47-50.
shu
ZOU Jiasheng, ZENG Peng, XU Xiangping. Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (11): 47-50.
Citation: ZOU Jiasheng, ZENG Peng, XU Xiangping. Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2012, (11): 47-50.
shu

非晶钎料加铜层连接Si3N4陶瓷的高温强度

Interfacial structure and strength of Si3N4 ceramics joint brazed with amorphous filler metal and Cu layer

    摘要
  • 摘要: 采用TiZrCuB非晶钎料和铜箔中间层连接Si3N4陶瓷,研究了钎料成分、中间层厚度和测试温度对接头高温强度的影响,分析了接头的强化机理.结果表明,随测试温度的升高,接头强度总体呈现先降低后升高的现象.在测试温度为773 K时,接头抗弯强度最低为135 MPa;但当测试温度升高致1 123 K时,接头抗弯强度达到230 MPa.通过插入铜中间层使界面反应层仅剩下连续致密的TiN层,脆性的Ti-Si化合物层被推向焊缝中心并细化呈颗粒状,这使接头室温强度和高温强度明显提高.

     

    Abstract: Si3N4 ceramics was brazed with TiZrCuB amorphous filler metal and Cu interlayer, the effect of brazing metal composition and thickness of copper foil on interfacial structure and bonding strength were studied in this paper.The result shows that the joint strength is up to 241 MPa when the brazing temperature is 1 323 K, holding time is 30min, the thickness of Cu interlayer is 70 m and the exerted pressure is 0.027 MPa.the reaction layer is TiN, the interface microstructure is compounds of Si3N4/TiN/Ti-Si+Ti-Zr+Cu-Zr+α-Cu;changing the thickness of interlayer can adjust the thickness and composition of the reaction layer;As the thickness of Cu interlayer increases, Ti-Si compound layer has gradually separated from the TiN layer, and it is pushed to the weld center and refined to a granula shape.

     

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