Sn-Zn-Ga-xPr钎料组织与性能
Microstructure and properties of Sn-Zn-Ga-xPr lead-free solder
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摘要: 研究了添加合金元素Ga及稀土元素Pr对Sn-Zn钎料组织与性能的影响.适量添加镨,可以提高钎料的润湿性能;但当镨含量超过0.12%(质量分数)时,镨会在钎料表面形成氧化渣,恶化钎料的润湿性能.镨的添加可以改善焊点的力学性能,抗剪强度在镨含量为0.08%时增加至最大.镨加入后细化了钎料基体中的富锌相,当镨含量不超过0.08%时,界面层平整且厚度变化不大,但若稀土添加过量,则界面层会明显增厚.镨在Sn9Zn0.5Ga钎料中的最佳添加量为0.08%左右.Abstract: Effects of rare earth element Pr additions on the microstructure and properties of Sn-Zn-Ga solder were studied in this paper.The wettability of solder was significantly improved by 0.08% Pr addition.However,the wettability of solder would deteriorate when the Pr addition exceeds 0.12% due to the oxidization of Pr element at the liquid surface.Moreover,the mechanical property of solder joint was improved by Pr addition and the maximum shear strength was obtained when 0.08% Pr was added.The Zn-rich phase in the solder matrix was refined by Pr but the thickness of interface layer showed no obvious difference when Pr was less than 0.08%.When excessive Pr was added,the interface layer thickness of the joint increased significantly,so that the optimal content of Pr in the Sn9Zn0.5Ga solder is about 0.08%.
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Keywords:
- Sn-Zn fill metal /
- wettability /
- mechanical properties /
- microstructure
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期刊类型引用(5)
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