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邹家生, 王超, 许祥平, 王磊. Cu-P基非晶钎料钎焊机理[J]. 焊接学报, 2011, (12): 33-36.
引用本文: 邹家生, 王超, 许祥平, 王磊. Cu-P基非晶钎料钎焊机理[J]. 焊接学报, 2011, (12): 33-36.
ZOU Jiasheng, WANG Chao, XU Xiangping, WANG Lei. Bonding mechanism of brazing of amorphous Cu-P filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 33-36.
Citation: ZOU Jiasheng, WANG Chao, XU Xiangping, WANG Lei. Bonding mechanism of brazing of amorphous Cu-P filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (12): 33-36.

Cu-P基非晶钎料钎焊机理

Bonding mechanism of brazing of amorphous Cu-P filler metal

  • 摘要: 采用CuP7.7Sn5.4Ni14Si0.2Zr0.04晶态与非晶钎料钎焊紫铜,通过微观手段对比分析了钎焊温度和保温时间对晶态与非晶态钎料钎焊接头成分和组织的影响.结果表明,CuP7.7Sn5.4Ni14Si0.2Zr0.04非晶钎料钎焊接头由界面区、扩散区以及钎缝中心区组成;随钎焊温度提高或保温时间增加,晶态钎料和非晶钎料钎焊接头界面区和扩散区不断增大,母材热影响区和钎缝中心组织也不断粗化,过高的钎焊温度或过长的保温时间,均会使界面区出现脆性相,但非晶钎料这种影响要小得多;在相同条件下,非晶钎料和母材的相互作用明显比相应的晶态钎料剧烈,其钎缝界面区较为均匀、连续,钎缝中心组织要明显均匀、细小.

     

    Abstract: The copper joints were brazed with CuP 7.7 Sn5.4Ni14Si0.2Zr0.04 amorphous filler metal conventional filler metal respectively. The effect of the brazing temperature and time on the crystalline composition and microstructure of joints brazed with the amorphous brazing filler metal were compared and analyzed by micro-method. The results showed that the joints brazed with CuP7.7Sn5.4Ni14Si0.2Zr0.04 amorphous brazing filler metal consist of centre zone, interface area and diffusion zone. With the increase of brazing temperature and brazing holding time, the interface area brazed with both amorphous and conventional filler metal increases, and the microstructures of base metal and brazinrg seam centre zone would be coarsed. Excessively high brazing temperature or long brazing holding time will produce brittle phase, but this effect on amorphous filler metals is much smaller. Under the same conditions, amorphous filler metals interact with the base metal much more intensely than the corresponding conventional filler metals. The microstructure in interface area and centre zone of amorphous brazing seam are evidently uniform and small.

     

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