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王俭辛, 尹明, 赖忠民, 李雪. Sn-Ag-Cu-In无铅钎料润湿性能及显微组织[J]. 焊接学报, 2011, (11): 69-72.
引用本文: 王俭辛, 尹明, 赖忠民, 李雪. Sn-Ag-Cu-In无铅钎料润湿性能及显微组织[J]. 焊接学报, 2011, (11): 69-72.
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WANG Jianxin, YIN Ming, LAI Zhongmin, LI Xue. Wettability and microstructure of Sn-Ag-Cu-In solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (11): 69-72.
Citation: WANG Jianxin, YIN Ming, LAI Zhongmin, LI Xue. Wettability and microstructure of Sn-Ag-Cu-In solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (11): 69-72.
shu

Sn-Ag-Cu-In无铅钎料润湿性能及显微组织

Wettability and microstructure of Sn-Ag-Cu-In solder

    摘要
  • 摘要: 在Sn-1.2Ag-0.6Cu合金中添加0~1.0%的In元素,研究了Sn-Ag-Cu-In无铅钎料的熔化温度、润湿性能及显微组织.结果表明,添加In元素对钎料的熔化温度有一定的降低作用,在相同的试验温度下,含铟钎料粘度更低,流动性更强,钎料的润湿性能随之改善.低银Sn-Ag-Cu钎料在空气中的润湿时间在260℃才达到t0 ≤ 1 s,而Sn-Ag-Cu-1.0In无铅钎料在氮气保护下在250℃时就已满足美国电子工业标准IPC/EIA J-STD-003B对于波峰焊润湿时间的推荐值t0 ≤ 1 s的要求.添加1.0%左右的In元素时,低银Sn-1.2Ag-0.6Cu钎料合金中Ag3Sn化合物有长大趋势,将不利于钎料合金的力学性能,因此添加铟含量宜控制在1.0%以内.

     

    Abstract: In order to improve the properties of Sn-1.2Ag-0.6Cu solder,small amount of In(0~1.0%) was added to the base alloys,the melting temperatures of alloys were tested,and the effect of In on the wettability and microstructure of solder alloy was studied. The melting temperature decreases with the addition of In. At the same soldering temperature,the lower melting temperature is,the higher superheat is,thus the viscosity of liquid solder is decreased and fluidity is improved. The zero time of Sn-1.2Ag-0.6Cu in air is below 1s at 260℃,while the zero time of Sn-1.2Ag-0.6Cu-1.0In in N2 atomsphere is below 1s at 250℃,meeting the demand of IPC/EIA J-STD-003B. The Ag3Sn in Sn-1.2Ag-0.6Cu alloy becomes coarser with 1.0% In added,which is harmful to the mechanical properties. Thenefore,the content of In addition into the Sn-1.2Ag-0.6Cu is not higher than 1.0%.

     

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