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赵快乐, 闫焉服, 唐坤, 盛阳阳. 微量银对Sn0.7Cu钎料物理性能及钎焊工艺性能的影响[J]. 焊接学报, 2011, (5): 65-68.
引用本文: 赵快乐, 闫焉服, 唐坤, 盛阳阳. 微量银对Sn0.7Cu钎料物理性能及钎焊工艺性能的影响[J]. 焊接学报, 2011, (5): 65-68.
shu
ZHAO Kuaile, YAN Yanfu, TANG Kun, SHENG Yangyang. Effect of content of Ag on physical properties and solderability of Sn0.7Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (5): 65-68.
Citation: ZHAO Kuaile, YAN Yanfu, TANG Kun, SHENG Yangyang. Effect of content of Ag on physical properties and solderability of Sn0.7Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2011, (5): 65-68.
shu

微量银对Sn0.7Cu钎料物理性能及钎焊工艺性能的影响

Effect of content of Ag on physical properties and solderability of Sn0.7Cu solder

    摘要
  • 摘要: SnCu共晶钎料是公认的SnPb钎料最具潜力的替代品,尤其在波峰焊上,但与其它无铅钎料相比,该钎料物理性能及铺展性能差,影响其广泛应用.通过在Sn0.7Cu合金基础上添加微量银来改善合金性能.结果表明,银含量对Sn0.7CuxAg钎料熔点影响不大,最大变化仅为0.3℃;随银含量增加,电阻率逐渐升高;同时,在Sn0.7Cu基体上添加微量银可以改善钎料合金铺展性能,Sn0.7Cu0.2Ag钎料铺展面积最大为28.61mm2,较基体提高了25.5%,这主要与形成的富银相及钎料与基板间金属间化合物状态有关.

     

    Abstract: SnCu eutectic solder is considered as the most potential substitutes of SnPb solder,particularly in wave soldering.But compared to other lead-free solders,its poor physical properties and spreading peformance limits its wide application.A new solder is made by adding trace Ag into Sn0.7Cu alloy to improve its performance.The results show that content of Ag has little influence on the melting point of Sn0.7CuxAg solder.The melting point of Sn0.7Cu0.2Ag is higher only 0.3℃ than that of matrix solder.The resistivity increases with the increase of the content of Ag.At the same time,the spreading performance of the new solder is improved by adding trace Ag into Sn0.7Cu.The spreading area of Sn0.7Cu0.2Ag reaches the maximum value of 28.61 mm2 and is increased 25.5% than that of the matrix solder,which is mainly related to the formation of the rich Ag phase and the thickness and shape of the metal intermetallic compound between the solder and the substrate.

     

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