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刘树英. 纯铜与不锈钢扩散焊接头性能及原子扩散动态解析[J]. 焊接学报, 2009, (9): 101-104.
引用本文: 刘树英. 纯铜与不锈钢扩散焊接头性能及原子扩散动态解析[J]. 焊接学报, 2009, (9): 101-104.
shu
LIU Shuying. Joints performance of diffusion bonding between pure Cu and stainless steel and dynamic analysis of atomic diffusion[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 101-104.
Citation: LIU Shuying. Joints performance of diffusion bonding between pure Cu and stainless steel and dynamic analysis of atomic diffusion[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (9): 101-104.
shu

纯铜与不锈钢扩散焊接头性能及原子扩散动态解析

Joints performance of diffusion bonding between pure Cu and stainless steel and dynamic analysis of atomic diffusion

    摘要
  • 摘要: 采用微观组织观察、硬度测试、拉伸试验、EPMA(电子探针)等手段研究了焊接工艺条件对纯铜与铁素体410L以及奥氏体304不锈钢扩散焊接接头性能的影响,结合理论计算对两种接头的原子扩散机理进行了解析.结果表明,在焊接压力、时间一定的条件下,接头的抗拉强度随焊接温度的升高而增大.Cu原子与410L最适宜的焊接温度比Cu原子与304的大约小50K,这是由于Cu原子向体心立方晶体(bcc)铁素体系中的扩散速度比在面心立方晶体(fcc)奥氏体系中快的缘故.Cu原子向不锈钢一侧扩散的实测值比理论值小是由于理论的初期条件是假定试样100%完全密接,而实际的接合界面却是粗糙不平,要达到接合初期的完全密接是需要时间的.

     

    Abstract: The effects of welding parametas on the performance of the joints of pure copper and ferrite 410L and joints of pure copper and austenite 304 stainless steel were researched by microstruture observation, hardness, tensile test and EPMA.And atomic diffusion mechanism of two kinds of joints combined theoretical calculation was also discussed.The result indicated:as bonding pressure and bonding time fixed, the joints tensile strength increased with the bonding temperature.Optimal bonding temperature of Cu/410L is about 50 K lower than that of Cu/304, because the diffusion speed of Cu, bcc ferrite is faster than in fcc austenitic.The measured diffusion speed of Cu atom in stainless steel is smaller than the theoretical value because the theoretical value was obtained based on assuming 100% full adhesion for the surface in initial, but the actual bonding surface is rough in initial stages.

     

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