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董文兴, 史耀武, 夏志东, 雷永平. Ni/P/Ce对SnAgCu抗氧化性能和结晶裂纹的影响[J]. 焊接学报, 2009, (3): 77-80.
引用本文: 董文兴, 史耀武, 夏志东, 雷永平. Ni/P/Ce对SnAgCu抗氧化性能和结晶裂纹的影响[J]. 焊接学报, 2009, (3): 77-80.
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DONG Wenxing, SHI Yaowu, XIA Zhidong, LEI Yongping. Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (3): 77-80.
Citation: DONG Wenxing, SHI Yaowu, XIA Zhidong, LEI Yongping. Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2009, (3): 77-80.
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Ni/P/Ce对SnAgCu抗氧化性能和结晶裂纹的影响

Effects of Ni/P/Ce on oxidation resistance and solidification crack of SnAgCu lead free solder alloy

    摘要
  • 摘要: 通过向Sn3.0Ag0.5Cu(SAC305)合金中添加微量的Ni,P和Ce元素,研究了各添加元素对合金钎料高温抗氧化性能和结晶裂纹的影响.结果表明,Ni元素的添加对钎料合金抗氧化性能没有很明显的改善,但明显地减少了合金表面结晶裂纹的总长度,抑制其产生;微量P元素的添加由于在合金钎料表面形成了复杂的致密新相,可以防止熔化钎料的表面直接与空气接触,明显改善了合金的抗氧化性能,但P元素的添加却增加了合金表面结晶裂纹的产生;Ce元素的添加恶化了钎料合金的抗氧化性,对合金表面的结晶裂纹抑制作用较小。

     

    Abstract: The effect of adding trace elements of Ni, P and Ce on the oxidation resistance and solidification crack of SAC305 solder alloys is investigated.Experimental results indicate that adding Ni can decrease the length of solidification crack and depress the formation of the crack, but can not improve the oxidation resistance of SAC305 solder alloy.Trace P addition, which forms a dense oxidation barrier on the surface of the solder, can improve the oxidation resistance of solder, but aggravates the formation of solidification crack on the surface of solder alloys.Addition of Ce can deteriorate the oxidation resistance of SAC305 solder alloy and slightly depress the solidification crack on the surface of the alloys.

     

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