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任振安, 赵继圆, 范珺, 洪贺. 电弧熔覆Ti-Si金属间化合物表面层的组织与性能[J]. 焊接学报, 2008, (11): 1-4.
引用本文: 任振安, 赵继圆, 范珺, 洪贺. 电弧熔覆Ti-Si金属间化合物表面层的组织与性能[J]. 焊接学报, 2008, (11): 1-4.
REN Zhen'an, ZHAO Jiyuan, FAN Jun, HONG He. Microsturctures and properties of Ti-Si intermetallic compound layers by arc cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (11): 1-4.
Citation: REN Zhen'an, ZHAO Jiyuan, FAN Jun, HONG He. Microsturctures and properties of Ti-Si intermetallic compound layers by arc cladding[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (11): 1-4.

电弧熔覆Ti-Si金属间化合物表面层的组织与性能

Microsturctures and properties of Ti-Si intermetallic compound layers by arc cladding

  • 摘要: 采用在纯钛基体上预敷硅粉,然后进行电弧熔覆的表面处理技术,通过改变焊接电流调整预敷硅粉与纯钛基体的熔化量,制备Ti-Si金属间化合物表面层,使基体获得表面冶金强化。用金相显微镜、扫描电镜和X射线衍射仪,对表面层的微观结构及界面进行了分析研究,并测试了显微硬度分布和耐磨性。结果表明,随着焊接电流增加,表面层的显微组织类型由亚共晶到共晶,最后为过共晶。Ti5Si3相使表面层具有较高的硬度,耐磨性比纯钛基体有明显提高。

     

    Abstract: The surface treatment technique of pre-placing silicon powders on the pure titanium substrate before arc cladding was applied to prepare Ti-Si intermetallic compound surface layers.Resulted in different fused amounts between pre-placing silicon powders and the pure titanium substrate prepare different surface layers by changing welding currents.The purpose was to strength the substrate metallurgically.The microstructures of the layers and the interfacial zone were investigated by optical microscopy, scanning electronic microscopy and X-ray diffraction.And the microhardness profiles and the abrasive resistance of the layers were measured.The experimental results showed that the microstructures of the arc cladded layers change from hypoeutectic, eutectic to hypereutecticwith increasing welding currents.Ti5Si3 phase hardened the layers and made their abrasive resistance obviously higher than that of the pure titanium substrate.

     

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