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孟工戈, 杨拓宇, 陈雷达, 王世珍, 李财富. Ge对SnAgCu/Cu钎焊界面结构的影响[J]. 焊接学报, 2008, (7): 51-53,56.
引用本文: 孟工戈, 杨拓宇, 陈雷达, 王世珍, 李财富. Ge对SnAgCu/Cu钎焊界面结构的影响[J]. 焊接学报, 2008, (7): 51-53,56.
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MENG Gongge, YANG Tuoyu, CHEN Leida, WANG Shizhen, LI Caifu. Effect of Ge on the SnAgCu/Cu soldering interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 51-53,56.
Citation: MENG Gongge, YANG Tuoyu, CHEN Leida, WANG Shizhen, LI Caifu. Effect of Ge on the SnAgCu/Cu soldering interface[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2008, (7): 51-53,56.
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Ge对SnAgCu/Cu钎焊界面结构的影响

Effect of Ge on the SnAgCu/Cu soldering interface

    摘要
  • 摘要: 化学元素周期表中Ge与Sn相邻,同为第Ⅳ主族元素,物理与化学性能近似。在无铅钎料Sn2.5Ag0.7Cu中添加少量Ge元素(质量分数分别为0.25%,0.5%,0.75%,1.0%),制作了钎焊界面。用扫描电子显微镜(SEM)对界面显微组织与形貌做了观察分析,用Auto CAD软件测量了金属间化合物(IMC)厚度,用能谱仪(EDX)分析了界面成分。结果表明,加入Ge元素后界面IMC的形貌仍为贝壳状,但该组织显示出长大趋势;经150℃/100 h老化后,界面变得更加平缓、整齐。钎料含Ge时,未老化界面IMC层厚度更大,经150℃/100 h老化后,IMC层增厚率要小。Ge元素的加入抑制老化过程中界面金属间化合物Cu6Sn5向Cu3Sn的转变和其自身的长大。

     

    Abstract: Germanium (Ge) is adjacent to Tin in periodic Table of the Elements;they are both in the main group Ⅳ and resemble each other in physical and chemical properties.A little element Ge was added into lead-free solder Sn2.5Ag0.7Cu (0.25, 0.5, 0.75, 1.0 wt%)and soldering interfaces were made up.The interfacial microstructure and photography were observed and analyzed with scanning electron microscope, the intermetallic compound thickness was measured with Auto CAD software, and interfacial composition was analyzed with energy dispersive X-ray analyzer.The results show that the pattern of IMC layer is pebble shape yet when adding element Ge, but displays a growth trend;the interface gets plainer and more regular with 150℃/100 h aging.The interfacial IMC layer is thicker with Ge in solder, but the ratio of getting thicker is smaller with 150℃/100 h aging.The addition of element Ge restrains the transformation of IMC Cu6Sn5 to Cu3Sn and the growth during aging.

     

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